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A-DFF 09 LPIII/Z-UNC Assmann WSW Components

Part No.:: A-DFF 09 LPIII/Z-UNC

Manufacturer:: Assmann WSW Components

Category:: D-Sub Connectors

Package:

Datasheet:: A-DFF 09 LPIII/Z-UNC.pdf

Description:: CONN D-SUB RCPT 9POS IDC

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is A-DFF 09 LPIII/Z-UNC Suitable For?

A-DFF 09 LPIII/Z-UNC is a D-Sub Connectors product from Assmann WSW Components, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable D-Sub Connectors components. Engineers can review the A-DFF 09 LPIII/Z-UNC datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Assmann WSW Components components are required, helping engineers evaluate A-DFF 09 LPIII/Z-UNC specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the A-DFF 09 LPIII/Z-UNC description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports A-DFF 09 LPIII/Z-UNC datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for A-DFF 09 LPIII/Z-UNC Pricing & Technical Support

Product Overview

A-DFF 09 LPIII/Z-UNC is a D-Sub Connectors product from Assmann WSW Components. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide A-DFF 09 LPIII/Z-UNC datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CONN D-SUB RCPT 9POS IDC

Key Features

Part Number:A-DFF 09 LPIII/Z-UNC
Manufacturer:Assmann WSW Components
Category:D-Sub Connectors
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

A-DFF 09 LPIII/Z-UNC may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for A-DFF 09 LPIII/Z-UNC stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tray
Series:

-
ProductStatus:

Active
ConnectorStyle:

D-Sub
ConnectorType:

Receptacle, Female Sockets
NumberofPositions:

9
NumberofRows:

2
MountingType:

Free Hanging (In-Line)
ShellSizeConnectorLayout:

1 (DE, E)
ContactType:

Signal
FlangeFeature:

Housing/Shell (4-40)
Termination:

IDC, Ribbon Cable
PrimaryMaterial:

-
ShellMaterialFinish:

Steel, Tin Plated
ContactFinish:

Gold
ContactFinishThickness:

Flash
IngressProtection:

-
MaterialFlammabilityRating:

UL94 V-0
CurrentRating(Amps):

3A
BacksetSpacing:

-
Category:

D-Sub Connectors
Datasheet:

A-DFF 09 LPIII/Z-UNC.pdf

A-DFF 09 LPIII/Z-UNC Frequently Asked Questions

Is A-DFF 09 LPIII/Z-UNC currently in stock? ▼

FudongIC currently shows 4,843 units of A-DFF 09 LPIII/Z-UNC in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for A-DFF 09 LPIII/Z-UNC? ▼

The minimum order quantity currently shown for A-DFF 09 LPIII/Z-UNC is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is A-DFF 09 LPIII/Z-UNC original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for A-DFF 09 LPIII/Z-UNC, please note this in your RFQ.

Can you provide a datasheet or technical support for A-DFF 09 LPIII/Z-UNC? ▼

Yes. You can view or download the A-DFF 09 LPIII/Z-UNC.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for A-DFF 09 LPIII/Z-UNC, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for A-DFF 09 LPIII/Z-UNC? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for A-DFF 09 LPIII/Z-UNC. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use A-DFF 09 LPIII/Z-UNC? ▼

As a D-Sub Connectors product from Assmann WSW Components, A-DFF 09 LPIII/Z-UNC may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.