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ADM1023ARQZ-REEL7 onsemi

Part No.:: ADM1023ARQZ-REEL7

Manufacturer:: onsemi

Category:: PMIC - Thermal Management

Package:: 16-SSOP (0.154, 3.90mm Width)

Datasheet:: ADM1023ARQZ-REEL7.pdf

Description:: IC SENSOR TEMP DUAL PREC 16QSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is ADM1023ARQZ-REEL7 Suitable For?

ADM1023ARQZ-REEL7 is a PMIC - Thermal Management product from onsemi, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Thermal Management components. Engineers can review the ADM1023ARQZ-REEL7 datasheet, package 16-SSOP (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original onsemi components are required, helping engineers evaluate ADM1023ARQZ-REEL7 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the ADM1023ARQZ-REEL7 description, package 16-SSOP (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports ADM1023ARQZ-REEL7 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for ADM1023ARQZ-REEL7 Pricing & Technical Support

Product Overview

ADM1023ARQZ-REEL7 is a PMIC - Thermal Management product from onsemi. It is supplied in package 16-SSOP (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide ADM1023ARQZ-REEL7 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC SENSOR TEMP DUAL PREC 16QSOP

Key Features

Part Number:ADM1023ARQZ-REEL7
Manufacturer:onsemi
Category:PMIC - Thermal Management
Package:16-SSOP (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

ADM1023ARQZ-REEL7 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for ADM1023ARQZ-REEL7 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Obsolete
Function:

Temp Monitoring System (Sensor)
SensorType:

Internal and External
SensingTemperature:

0°C ~ 120°C, External Sensor
Accuracy:

±1°C Local, ±3°C Remote
Topology:

ADC, Comparator, Multiplexer, Register Bank
OutputType:

SMBus
OutputAlarm:

Yes
OutputFan:

No
Voltage-Supply:

3V ~ 5.5V
OperatingTemperature:

0°C ~ 120°C
MountingType:

Surface Mount
Category:

PMIC - Thermal Management
Datasheet:

ADM1023ARQZ-REEL7.pdf

ADM1023ARQZ-REEL7 Frequently Asked Questions

Is ADM1023ARQZ-REEL7 currently in stock? ▼

FudongIC currently shows 3,925 units of ADM1023ARQZ-REEL7 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for ADM1023ARQZ-REEL7? ▼

The minimum order quantity currently shown for ADM1023ARQZ-REEL7 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is ADM1023ARQZ-REEL7 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for ADM1023ARQZ-REEL7, please note this in your RFQ.

Can you provide a datasheet or technical support for ADM1023ARQZ-REEL7? ▼

Yes. You can view or download the ADM1023ARQZ-REEL7.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for ADM1023ARQZ-REEL7, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for ADM1023ARQZ-REEL7? ▼

Yes. Based on your application, preferred manufacturer, package 16-SSOP (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for ADM1023ARQZ-REEL7. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use ADM1023ARQZ-REEL7? ▼

As a PMIC - Thermal Management product from onsemi, ADM1023ARQZ-REEL7 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.