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AKA874N0085152A000 TE Intercontec

Part No.:: AKA874N0085152A000

Manufacturer:: TE Intercontec

Category:: Circular Connectors - Housings

Package:

Datasheet:: AKA874N0085152A000.pdf

Description:: CONN RCP HSG M 17P INLINE PNL MT

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is AKA874N0085152A000 Suitable For?

AKA874N0085152A000 is a Circular Connectors - Housings product from TE Intercontec, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Circular Connectors - Housings components. Engineers can review the AKA874N0085152A000 datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original TE Intercontec components are required, helping engineers evaluate AKA874N0085152A000 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the AKA874N0085152A000 description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports AKA874N0085152A000 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for AKA874N0085152A000 Pricing & Technical Support

Product Overview

AKA874N0085152A000 is a Circular Connectors - Housings product from TE Intercontec. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide AKA874N0085152A000 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CONN RCP HSG M 17P INLINE PNL MT

Key Features

Part Number:AKA874N0085152A000
Manufacturer:TE Intercontec
Category:Circular Connectors - Housings
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

AKA874N0085152A000 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for AKA874N0085152A000 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Box
Series:

617
ProductStatus:

Active
ConnectorType:

Receptacle Housing
Type:

For Male Pins
NumberofPositions:

17
ShellSize-Insert:

M17-17
ShellSizeMIL:

-
ContactType:

-
ContactSize:

-
MountingType:

Free Hanging (In-Line); Panel Mount
MountingFeature:

Bulkhead - Front Side Nut
FasteningType:

Push-Twist
Orientation:

Keyed
PrimaryMaterial:

-
ShellMaterial:

Zinc Die Cast
ShellFinish:

Nickel
HousingColor:

Silver
IngressProtection:

IP66/IP67 - Dust Tight, Water Resistant, Waterproof
MaterialFlammabilityRating:

UL94 V-0
Features:

Backshell, Cable Clamp
Category:

Circular Connectors - Housings
Datasheet:

AKA874N0085152A000.pdf

AKA874N0085152A000 Frequently Asked Questions

Is AKA874N0085152A000 currently in stock? ▼

FudongIC currently shows 3,623 units of AKA874N0085152A000 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for AKA874N0085152A000? ▼

The minimum order quantity currently shown for AKA874N0085152A000 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is AKA874N0085152A000 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for AKA874N0085152A000, please note this in your RFQ.

Can you provide a datasheet or technical support for AKA874N0085152A000? ▼

Yes. You can view or download the AKA874N0085152A000.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for AKA874N0085152A000, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for AKA874N0085152A000? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for AKA874N0085152A000. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use AKA874N0085152A000? ▼

As a Circular Connectors - Housings product from TE Intercontec, AKA874N0085152A000 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.