View More Product Categories >>

AST1350604 METZ CONNECT USA Inc.

Q: Is AST1350604 currently in stock?

FudongIC currently shows 696 units of AST1350604 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

AST1350604 METZ CONNECT USA Inc. Terminal Blocks - Wire to Board

Compare

Part No.:: AST1350604

Manufacturer:: METZ CONNECT USA Inc.

Category:: Terminal Blocks - Wire to Board

Package:

Datasheet:: AST1350604.pdf

Description:: TERM BLOCK 6POS 45DEG 5MM PCB

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is AST1350604 Suitable For?

AST1350604 is a Terminal Blocks - Wire to Board product from METZ CONNECT USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Terminal Blocks - Wire to Board components. Engineers can review the AST1350604 datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original METZ CONNECT USA Inc. components are required, helping engineers evaluate AST1350604 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the AST1350604 description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports AST1350604 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for AST1350604 Pricing & Technical Support

Product Overview

AST1350604 is a Terminal Blocks - Wire to Board product from METZ CONNECT USA Inc.. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide AST1350604 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: TERM BLOCK 6POS 45DEG 5MM PCB

Key Features

Part Number:AST1350604
Manufacturer:METZ CONNECT USA Inc.
Category:Terminal Blocks - Wire to Board
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

AST1350604 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for AST1350604 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:
RoHS:

RoHS
Color:

Gray
Pitch:

0.197" (5.00mm)
Current:

13 A
Voltage:

300 V
Features:

Lever Actuated
Wire Gauge:

14-28 AWG
Part Status:

Active
Mounting Type:

Through Hole
Number of Levels:

1
Wire Termination:

Screwless - Spring Cage, Tension Clamp
Mating Orientation:

45° (135°) Angle with Board
Positions Per Level:

6
Category:

Terminal Blocks - Wire to Board
Datasheet:

AST1350604.pdf

AST1350604 Frequently Asked Questions

Is AST1350604 currently in stock? ▼

FudongIC currently shows 696 units of AST1350604 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for AST1350604? ▼

The minimum order quantity currently shown for AST1350604 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is AST1350604 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for AST1350604, please note this in your RFQ.

Can you provide a datasheet or technical support for AST1350604? ▼

Yes. You can view or download the AST1350604.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for AST1350604, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for AST1350604? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for AST1350604. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use AST1350604? ▼

As a Terminal Blocks - Wire to Board product from METZ CONNECT USA Inc., AST1350604 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.