All Categories

View More Product Categories >>

BCV62CE6327HTSA1 Infineon Technologies

Part No.:: BCV62CE6327HTSA1

Manufacturer:: Infineon Technologies

Category:: Transistors - Bipolar (BJT) - Arrays

Package:: TO-253-4, TO-253AA

Datasheet:: BCV62CE6327HTSA1.pdf

Description:: TRANS 2PNP 30V 0.1A SOT143

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is BCV62CE6327HTSA1 Suitable For?

BCV62CE6327HTSA1 is a Transistors - Bipolar (BJT) - Arrays product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - Bipolar (BJT) - Arrays components. Engineers can review the BCV62CE6327HTSA1 datasheet, package TO-253-4, TO-253AA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate BCV62CE6327HTSA1 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BCV62CE6327HTSA1 description, package TO-253-4, TO-253AA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BCV62CE6327HTSA1 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BCV62CE6327HTSA1 Pricing & Technical Support

Product Overview

BCV62CE6327HTSA1 is a Transistors - Bipolar (BJT) - Arrays product from Infineon Technologies. It is supplied in package TO-253-4, TO-253AA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BCV62CE6327HTSA1 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: TRANS 2PNP 30V 0.1A SOT143

Key Features

Part Number:BCV62CE6327HTSA1
Manufacturer:Infineon Technologies
Category:Transistors - Bipolar (BJT) - Arrays
Package:TO-253-4, TO-253AA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BCV62CE6327HTSA1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BCV62CE6327HTSA1 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Not For New Designs
TransistorType:

2 PNP (Dual)
Current-Collector(Ic)(Max):

100mA
Voltage-CollectorEmitterBreakdown(Max):

30V
VceSaturation(Max)@IbIc:

650mV @ 5mA, 100mA
Current-CollectorCutoff(Max):

15nA (ICBO)
DCCurrentGain(hFE)(Min)@IcVce:

420 @ 2mA, 5V
Power-Max:

300mW
Frequency-Transition:

250MHz
OperatingTemperature:

150°C (TJ)
MountingType:

Surface Mount
Category:

Transistors - Bipolar (BJT) - Arrays
Datasheet:

BCV62CE6327HTSA1.pdf

BCV62CE6327HTSA1 Frequently Asked Questions

Is BCV62CE6327HTSA1 currently in stock? ▼

FudongIC currently shows 3,744 units of BCV62CE6327HTSA1 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BCV62CE6327HTSA1? ▼

The minimum order quantity currently shown for BCV62CE6327HTSA1 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BCV62CE6327HTSA1 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BCV62CE6327HTSA1, please note this in your RFQ.

Can you provide a datasheet or technical support for BCV62CE6327HTSA1? ▼

Yes. You can view or download the BCV62CE6327HTSA1.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BCV62CE6327HTSA1, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BCV62CE6327HTSA1? ▼

Yes. Based on your application, preferred manufacturer, package TO-253-4, TO-253AA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BCV62CE6327HTSA1. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BCV62CE6327HTSA1? ▼

As a Transistors - Bipolar (BJT) - Arrays product from Infineon Technologies, BCV62CE6327HTSA1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.