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BDN09-3CB/A01 CTS Thermal Management Products

Part No.:: BDN09-3CB/A01

Manufacturer:: CTS Thermal Management Products

Category:: Thermal - Heat Sinks

Package:: Assorted (BGA, LGA, CPU, ASIC...)

Datasheet:: BDN09-3CB/A01.pdf

Description:: HEATSINK CPU W/ADHESIVE .91SQ

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is BDN09-3CB/A01 Suitable For?

BDN09-3CB/A01 is a Thermal - Heat Sinks product from CTS Thermal Management Products, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the BDN09-3CB/A01 datasheet, package Assorted (BGA, LGA, CPU, ASIC...) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original CTS Thermal Management Products components are required, helping engineers evaluate BDN09-3CB/A01 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BDN09-3CB/A01 description, package Assorted (BGA, LGA, CPU, ASIC...) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BDN09-3CB/A01 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BDN09-3CB/A01 Pricing & Technical Support

Product Overview

BDN09-3CB/A01 is a Thermal - Heat Sinks product from CTS Thermal Management Products. It is supplied in package Assorted (BGA, LGA, CPU, ASIC...) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BDN09-3CB/A01 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: HEATSINK CPU W/ADHESIVE .91SQ

Key Features

Part Number:BDN09-3CB/A01
Manufacturer:CTS Thermal Management Products
Category:Thermal - Heat Sinks
Package:Assorted (BGA, LGA, CPU, ASIC...)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BDN09-3CB/A01 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BDN09-3CB/A01 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Box
Series:

BDN
ProductStatus:

Active
Type:

Top Mount
PackageCooled:

Thermal Tape, Adhesive (Included)
AttachmentMethod:

Square, Pin Fins
Shape:

0.910 (23.11mm)
Length:

0.910 (23.11mm)
Width:

-
Diameter:

0.355 (9.02mm)
FinHeight:

-
PowerDissipation@TemperatureRise:

9.60°C/W @ 400 LFM
ThermalResistance@ForcedAirFlow:

26.90°C/W
ThermalResistance@Natural:

Aluminum
Material:
Category:

Thermal - Heat Sinks
Datasheet:

BDN09-3CB/A01.pdf

BDN09-3CB/A01 Frequently Asked Questions

Is BDN09-3CB/A01 currently in stock? ▼

FudongIC currently shows 2,720 units of BDN09-3CB/A01 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BDN09-3CB/A01? ▼

The minimum order quantity currently shown for BDN09-3CB/A01 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BDN09-3CB/A01 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BDN09-3CB/A01, please note this in your RFQ.

Can you provide a datasheet or technical support for BDN09-3CB/A01? ▼

Yes. You can view or download the BDN09-3CB/A01.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BDN09-3CB/A01, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BDN09-3CB/A01? ▼

Yes. Based on your application, preferred manufacturer, package Assorted (BGA, LGA, CPU, ASIC...), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BDN09-3CB/A01. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BDN09-3CB/A01? ▼

As a Thermal - Heat Sinks product from CTS Thermal Management Products, BDN09-3CB/A01 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.