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BFSA100A Essentra Components

Part No.:: BFSA100A

Manufacturer:: Essentra Components

Category:: Bumpers, Feet, Pads, Grips

Package:

Datasheet:: BFSA100A.pdf

Description:: PUSH FIT BUMPER: COMPATIBLE HOLE

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is BFSA100A Suitable For?

BFSA100A is a Bumpers, Feet, Pads, Grips product from Essentra Components, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Bumpers, Feet, Pads, Grips components. Engineers can review the BFSA100A datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Essentra Components components are required, helping engineers evaluate BFSA100A specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BFSA100A description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BFSA100A datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BFSA100A Pricing & Technical Support

Product Overview

BFSA100A is a Bumpers, Feet, Pads, Grips product from Essentra Components. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BFSA100A datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: PUSH FIT BUMPER: COMPATIBLE HOLE

Key Features

Part Number:BFSA100A
Manufacturer:Essentra Components
Category:Bumpers, Feet, Pads, Grips
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BFSA100A may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BFSA100A stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bag
Series:

Alliance Plastics
ProductStatus:

Active
Type:

Bumper
Shape:

Cylindrical, Tapered
Color:

Black
Size/Dimension:

1.000 Dia (25.40mm)
Thickness:

0.180 (4.57mm)
Material:

Polyethylene
Hardness:

-
Form:

-
Category:

Bumpers, Feet, Pads, Grips
Datasheet:

BFSA100A.pdf

BFSA100A Frequently Asked Questions

Is BFSA100A currently in stock? ▼

FudongIC currently shows 2,062 units of BFSA100A in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BFSA100A? ▼

The minimum order quantity currently shown for BFSA100A is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BFSA100A original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BFSA100A, please note this in your RFQ.

Can you provide a datasheet or technical support for BFSA100A? ▼

Yes. You can view or download the BFSA100A.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BFSA100A, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BFSA100A? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BFSA100A. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BFSA100A? ▼

As a Bumpers, Feet, Pads, Grips product from Essentra Components, BFSA100A may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.