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BSB053N03LP G Infineon Technologies

Part No.:: BSB053N03LP G

Manufacturer:: Infineon Technologies

Category:: Transistors - FETs, MOSFETs - Single

Package:: MG-WDSON-2, CanPAK M™

Datasheet:: BSB053N03LP G.pdf

Description:: MOSFET N-CH 30V 17A/71A 2WDSON

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Application Scenarios

What Applications Is BSB053N03LP G Suitable For?

BSB053N03LP G is a Transistors - FETs, MOSFETs - Single product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - FETs, MOSFETs - Single components. Engineers can review the BSB053N03LP G datasheet, package MG-WDSON-2, CanPAK M™ and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate BSB053N03LP G specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BSB053N03LP G description, package MG-WDSON-2, CanPAK M™ and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BSB053N03LP G datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BSB053N03LP G Pricing & Technical Support

Product Overview

BSB053N03LP G is a Transistors - FETs, MOSFETs - Single product from Infineon Technologies. It is supplied in package MG-WDSON-2, CanPAK M™ and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BSB053N03LP G datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: MOSFET N-CH 30V 17A/71A 2WDSON

Key Features

Part Number:BSB053N03LP G
Manufacturer:Infineon Technologies
Category:Transistors - FETs, MOSFETs - Single
Package:MG-WDSON-2, CanPAK M™
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BSB053N03LP G may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BSB053N03LP G stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

OptiMOS™
ProductStatus:

Obsolete
FETType:

N-Channel
Technology:

MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss):

30 V
Current-ContinuousDrain(Id)@25°C:

17A (Ta), 71A (Tc)
DriveVoltage(MaxRdsOnMinRdsOn):

4.5V, 10V
RdsOn(Max)@IdVgs:

5.3mOhm @ 30A, 10V
Vgs(th)(Max)@Id:

2.2V @ 250µA
GateCharge(Qg)(Max)@Vgs:

29 nC @ 10 V
Vgs(Max):

±20V
InputCapacitance(Ciss)(Max)@Vds:

2700 pF @ 15 V
FETFeature:

-
PowerDissipation(Max):

2.3W (Ta), 42W (Tc)
OperatingTemperature:

-40°C ~ 150°C (TJ)
MountingType:

Surface Mount
Category:

Transistors - FETs, MOSFETs - Single
Datasheet:

BSB053N03LP G.pdf

BSB053N03LP G Frequently Asked Questions

Is BSB053N03LP G currently in stock? ▼

FudongIC currently shows 2,219 units of BSB053N03LP G in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BSB053N03LP G? ▼

The minimum order quantity currently shown for BSB053N03LP G is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BSB053N03LP G original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BSB053N03LP G, please note this in your RFQ.

Can you provide a datasheet or technical support for BSB053N03LP G? ▼

Yes. You can view or download the BSB053N03LP G.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BSB053N03LP G, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BSB053N03LP G? ▼

Yes. Based on your application, preferred manufacturer, package MG-WDSON-2, CanPAK M™, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BSB053N03LP G. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BSB053N03LP G? ▼

As a Transistors - FETs, MOSFETs - Single product from Infineon Technologies, BSB053N03LP G may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.