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BSM300D12P3E005 Rohm Semiconductor

Part No.:: BSM300D12P3E005

Manufacturer:: Rohm Semiconductor

Category:: Transistors - FETs, MOSFETs - Arrays

Package:: Module

Datasheet:: BSM300D12P3E005.pdf

Description:: SILICON CARBIDE POWER MODULE. B

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Application Scenarios

What Applications Is BSM300D12P3E005 Suitable For?

BSM300D12P3E005 is a Transistors - FETs, MOSFETs - Arrays product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - FETs, MOSFETs - Arrays components. Engineers can review the BSM300D12P3E005 datasheet, package Module and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BSM300D12P3E005 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BSM300D12P3E005 description, package Module and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BSM300D12P3E005 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BSM300D12P3E005 Pricing & Technical Support

Product Overview

BSM300D12P3E005 is a Transistors - FETs, MOSFETs - Arrays product from Rohm Semiconductor. It is supplied in package Module and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BSM300D12P3E005 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SILICON CARBIDE POWER MODULE. B

Key Features

Part Number:BSM300D12P3E005
Manufacturer:Rohm Semiconductor
Category:Transistors - FETs, MOSFETs - Arrays
Package:Module
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BSM300D12P3E005 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BSM300D12P3E005 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Active
FETType:

2 N-Channel (Half Bridge)
FETFeature:

Silicon Carbide (SiC)
DraintoSourceVoltage(Vdss):

1200V (1.2kV)
Current-ContinuousDrain(Id)@25°C:

300A (Tc)
RdsOn(Max)@IdVgs:

-
Vgs(th)(Max)@Id:

5.6V @ 91mA
GateCharge(Qg)(Max)@Vgs:

-
InputCapacitance(Ciss)(Max)@Vds:

14000pF @ 10V
Power-Max:

1260W (Tc)
OperatingTemperature:

-40°C ~ 150°C (TJ)
MountingType:

Chassis Mount
Category:

Transistors - FETs, MOSFETs - Arrays
Datasheet:

BSM300D12P3E005.pdf

BSM300D12P3E005 Frequently Asked Questions

Is BSM300D12P3E005 currently in stock? ▼

FudongIC currently shows 2,760 units of BSM300D12P3E005 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BSM300D12P3E005? ▼

The minimum order quantity currently shown for BSM300D12P3E005 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BSM300D12P3E005 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BSM300D12P3E005, please note this in your RFQ.

Can you provide a datasheet or technical support for BSM300D12P3E005? ▼

Yes. You can view or download the BSM300D12P3E005.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BSM300D12P3E005, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BSM300D12P3E005? ▼

Yes. Based on your application, preferred manufacturer, package Module, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BSM300D12P3E005. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BSM300D12P3E005? ▼

As a Transistors - FETs, MOSFETs - Arrays product from Rohm Semiconductor, BSM300D12P3E005 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

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