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BU2507FV-E2 Rohm Semiconductor

Part No.:: BU2507FV-E2

Manufacturer:: Rohm Semiconductor

Category:: Data Acquisition - Digital to Analog Converters (DAC)

Package:: 14-LSSOP (0.173, 4.40mm Width)

Datasheet:: BU2507FV-E2.pdf

Description:: IC DAC 10BIT V-OUT 14SSOPB

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is BU2507FV-E2 Suitable For?

BU2507FV-E2 is a Data Acquisition - Digital to Analog Converters (DAC) product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Data Acquisition - Digital to Analog Converters (DAC) components. Engineers can review the BU2507FV-E2 datasheet, package 14-LSSOP (0.173, 4.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BU2507FV-E2 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BU2507FV-E2 description, package 14-LSSOP (0.173, 4.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BU2507FV-E2 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BU2507FV-E2 Pricing & Technical Support

Product Overview

BU2507FV-E2 is a Data Acquisition - Digital to Analog Converters (DAC) product from Rohm Semiconductor. It is supplied in package 14-LSSOP (0.173, 4.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BU2507FV-E2 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC DAC 10BIT V-OUT 14SSOPB

Key Features

Part Number:BU2507FV-E2
Manufacturer:Rohm Semiconductor
Category:Data Acquisition - Digital to Analog Converters (DAC)
Package:14-LSSOP (0.173, 4.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BU2507FV-E2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BU2507FV-E2 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

14-LSSOP (0.173, 4.40mm Width)
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
NumberofBits:

10
NumberofD/AConverters:

6
SettlingTime:

20µs
OutputType:

Voltage - Buffered
DifferentialOutput:

No
DataInterface:

SPI
ReferenceType:

Supply
Voltage-SupplyAnalog:

5V
Voltage-SupplyDigital:

5V
INL/DNL(LSB):

±3.5 (Max), ±1 (Max)
Architecture:

R-2R
OperatingTemperature:

-30°C ~ 85°C
Category:

Data Acquisition - Digital to Analog Converters (DAC)
Datasheet:

BU2507FV-E2.pdf

BU2507FV-E2 Frequently Asked Questions

Is BU2507FV-E2 currently in stock? ▼

FudongIC currently shows 8,797 units of BU2507FV-E2 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BU2507FV-E2? ▼

The minimum order quantity currently shown for BU2507FV-E2 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BU2507FV-E2 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BU2507FV-E2, please note this in your RFQ.

Can you provide a datasheet or technical support for BU2507FV-E2? ▼

Yes. You can view or download the BU2507FV-E2.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BU2507FV-E2, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BU2507FV-E2? ▼

Yes. Based on your application, preferred manufacturer, package 14-LSSOP (0.173, 4.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BU2507FV-E2. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BU2507FV-E2? ▼

As a Data Acquisition - Digital to Analog Converters (DAC) product from Rohm Semiconductor, BU2507FV-E2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.