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BU26156RFS-E2 Rohm Semiconductor

Part No.:: BU26156RFS-E2

Manufacturer:: Rohm Semiconductor

Category:: Interface - CODECs

Package:: 44-VSOP (0.295, 7.50mm Width) Exposed Pad

Datasheet:: BU26156RFS-E2.pdf

Description:: IC AUDIO CODEC 24BIT 44HTSSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

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Application Scenarios

What Applications Is BU26156RFS-E2 Suitable For?

BU26156RFS-E2 is a Interface - CODECs product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - CODECs components. Engineers can review the BU26156RFS-E2 datasheet, package 44-VSOP (0.295, 7.50mm Width) Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BU26156RFS-E2 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BU26156RFS-E2 description, package 44-VSOP (0.295, 7.50mm Width) Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BU26156RFS-E2 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BU26156RFS-E2 Pricing & Technical Support

Product Overview

BU26156RFS-E2 is a Interface - CODECs product from Rohm Semiconductor. It is supplied in package 44-VSOP (0.295, 7.50mm Width) Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BU26156RFS-E2 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC AUDIO CODEC 24BIT 44HTSSOP

Key Features

Part Number:BU26156RFS-E2
Manufacturer:Rohm Semiconductor
Category:Interface - CODECs
Package:44-VSOP (0.295, 7.50mm Width) Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BU26156RFS-E2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BU26156RFS-E2 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

44-VSOP (0.295, 7.50mm Width) Exposed Pad
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
Type:

Audio
DataInterface:

Serial
Resolution(Bits):

24 b
NumberofADCs/DACs:

2 / 2
SigmaDelta:

No
S/NRatioADCs/DACs(db)Typ:

93 / 95
DynamicRangeADCs/DACs(db)Typ:

-
Voltage-SupplyAnalog:

2.7V ~ 3.6V
Voltage-SupplyDigital:

2.7V ~ 3.6V
OperatingTemperature:

-20°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - CODECs
Datasheet:

BU26156RFS-E2.pdf

BU26156RFS-E2 Frequently Asked Questions

Is BU26156RFS-E2 currently in stock? ▼

FudongIC currently shows 1,278 units of BU26156RFS-E2 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BU26156RFS-E2? ▼

The minimum order quantity currently shown for BU26156RFS-E2 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BU26156RFS-E2 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BU26156RFS-E2, please note this in your RFQ.

Can you provide a datasheet or technical support for BU26156RFS-E2? ▼

Yes. You can view or download the BU26156RFS-E2.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BU26156RFS-E2, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BU26156RFS-E2? ▼

Yes. Based on your application, preferred manufacturer, package 44-VSOP (0.295, 7.50mm Width) Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BU26156RFS-E2. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BU26156RFS-E2? ▼

As a Interface - CODECs product from Rohm Semiconductor, BU26156RFS-E2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.