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BU4053BC Rohm Semiconductor

Part No.:: BU4053BC

Manufacturer:: Rohm Semiconductor

Category:: Interface - Analog Switches, Multiplexers, Demultiplexers

Package:: 16-DIP (0.300, 7.62mm)

Datasheet:: BU4053BC.pdf

Description:: IC MUX/DEMUX TRIPLE 2X1 16DIP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is BU4053BC Suitable For?

BU4053BC is a Interface - Analog Switches, Multiplexers, Demultiplexers product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Analog Switches, Multiplexers, Demultiplexers components. Engineers can review the BU4053BC datasheet, package 16-DIP (0.300, 7.62mm) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BU4053BC specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BU4053BC description, package 16-DIP (0.300, 7.62mm) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BU4053BC datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BU4053BC Pricing & Technical Support

Product Overview

BU4053BC is a Interface - Analog Switches, Multiplexers, Demultiplexers product from Rohm Semiconductor. It is supplied in package 16-DIP (0.300, 7.62mm) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BU4053BC datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MUX/DEMUX TRIPLE 2X1 16DIP

Key Features

Part Number:BU4053BC
Manufacturer:Rohm Semiconductor
Category:Interface - Analog Switches, Multiplexers, Demultiplexers
Package:16-DIP (0.300, 7.62mm)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BU4053BC may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BU4053BC stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

16-DIP (0.300, 7.62mm)
Packaging:

Tube
Series:

-
ProductStatus:

Obsolete
SwitchCircuit:

SPDT
Multiplexer/DemultiplexerCircuit:

2:1
NumberofCircuits:

3
On-StateResistance(Max):

160Ohm
Channel-to-ChannelMatching(ΔRon):

-
Voltage-SupplySingle(V+):

3V ~ 18V
Voltage-SupplyDual(V±):

-
SwitchTime(TonToff)(Max):

-
-3dbBandwidth:

-
ChargeInjection:

-
ChannelCapacitance(CS(off)CD(off)):

10pF
Current-Leakage(IS(off))(Max):

300nA
Crosstalk:

-
OperatingTemperature:

-40°C ~ 85°C (TA)
MountingType:

Through Hole
Category:

Interface - Analog Switches, Multiplexers, Demultiplexers
Datasheet:

BU4053BC.pdf

BU4053BC Frequently Asked Questions

Is BU4053BC currently in stock? ▼

FudongIC currently shows 2,782 units of BU4053BC in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BU4053BC? ▼

The minimum order quantity currently shown for BU4053BC is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BU4053BC original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BU4053BC, please note this in your RFQ.

Can you provide a datasheet or technical support for BU4053BC? ▼

Yes. You can view or download the BU4053BC.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BU4053BC, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BU4053BC? ▼

Yes. Based on your application, preferred manufacturer, package 16-DIP (0.300, 7.62mm), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BU4053BC. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BU4053BC? ▼

As a Interface - Analog Switches, Multiplexers, Demultiplexers product from Rohm Semiconductor, BU4053BC may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.