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BU7244SF-E2 Rohm Semiconductor

Part No.:: BU7244SF-E2

Manufacturer:: Rohm Semiconductor

Category:: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Package:: 14-SOIC (0.173, 4.40mm Width)

Datasheet:: BU7244SF-E2.pdf

Description:: IC CMOS 4 CIRCUIT 14SOP

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Application Scenarios

What Applications Is BU7244SF-E2 Suitable For?

BU7244SF-E2 is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps components. Engineers can review the BU7244SF-E2 datasheet, package 14-SOIC (0.173, 4.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BU7244SF-E2 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BU7244SF-E2 description, package 14-SOIC (0.173, 4.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BU7244SF-E2 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BU7244SF-E2 Pricing & Technical Support

Product Overview

BU7244SF-E2 is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Rohm Semiconductor. It is supplied in package 14-SOIC (0.173, 4.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BU7244SF-E2 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC CMOS 4 CIRCUIT 14SOP

Key Features

Part Number:BU7244SF-E2
Manufacturer:Rohm Semiconductor
Category:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Package:14-SOIC (0.173, 4.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BU7244SF-E2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BU7244SF-E2 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

14-SOIC (0.173, 4.40mm Width)
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
AmplifierType:

CMOS
NumberofCircuits:

4
OutputType:

Rail-to-Rail
SlewRate:

0.4V/µs
GainBandwidthProduct:

900 kHz
-3dbBandwidth:

-
Current-InputBias:

1 pA
Voltage-InputOffset:

1 mV
Current-Supply:

360µA
Current-Output/Channel:

12 mA
Voltage-SupplySpan(Min):

1.8 V
Voltage-SupplySpan(Max):

5.5 V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet:

BU7244SF-E2.pdf

BU7244SF-E2 Frequently Asked Questions

Is BU7244SF-E2 currently in stock? ▼

FudongIC currently shows 2,193 units of BU7244SF-E2 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BU7244SF-E2? ▼

The minimum order quantity currently shown for BU7244SF-E2 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BU7244SF-E2 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BU7244SF-E2, please note this in your RFQ.

Can you provide a datasheet or technical support for BU7244SF-E2? ▼

Yes. You can view or download the BU7244SF-E2.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BU7244SF-E2, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BU7244SF-E2? ▼

Yes. Based on your application, preferred manufacturer, package 14-SOIC (0.173, 4.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BU7244SF-E2. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BU7244SF-E2? ▼

As a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Rohm Semiconductor, BU7244SF-E2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.