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BU8874F Rohm Semiconductor

Part No.:: BU8874F

Manufacturer:: Rohm Semiconductor

Category:: Interface - Telecom

Package:: 18-SOIC (0.213, 5.40mm Width)

Datasheet:: BU8874F.pdf

Description:: IC TELECOM INTERFACE 18SOP

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Application Scenarios

What Applications Is BU8874F Suitable For?

BU8874F is a Interface - Telecom product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Telecom components. Engineers can review the BU8874F datasheet, package 18-SOIC (0.213, 5.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BU8874F specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BU8874F description, package 18-SOIC (0.213, 5.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BU8874F datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BU8874F Pricing & Technical Support

Product Overview

BU8874F is a Interface - Telecom product from Rohm Semiconductor. It is supplied in package 18-SOIC (0.213, 5.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BU8874F datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC TELECOM INTERFACE 18SOP

Key Features

Part Number:BU8874F
Manufacturer:Rohm Semiconductor
Category:Interface - Telecom
Package:18-SOIC (0.213, 5.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BU8874F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BU8874F stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

18-SOIC (0.213, 5.40mm Width)
Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Obsolete
Function:

Receiver, DTMF
Interface:

-
NumberofCircuits:

1
Voltage-Supply:

4.75V ~ 5.25V
Current-Supply:

2.2mA
Power(Watts):

550 mW
OperatingTemperature:

-10°C ~ 70°C
MountingType:

Surface Mount
Category:

Interface - Telecom
Datasheet:

BU8874F.pdf

BU8874F Frequently Asked Questions

Is BU8874F currently in stock? ▼

FudongIC currently shows 3,301 units of BU8874F in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BU8874F? ▼

The minimum order quantity currently shown for BU8874F is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BU8874F original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BU8874F, please note this in your RFQ.

Can you provide a datasheet or technical support for BU8874F? ▼

Yes. You can view or download the BU8874F.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BU8874F, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BU8874F? ▼

Yes. Based on your application, preferred manufacturer, package 18-SOIC (0.213, 5.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BU8874F. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BU8874F? ▼

As a Interface - Telecom product from Rohm Semiconductor, BU8874F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.