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CLVTH162245IDGGREP Texas Instruments

Part No.:: CLVTH162245IDGGREP

Manufacturer:: Texas Instruments

Category:: Logic - Buffers, Drivers, Receivers, Transceivers

Package:: 48-TFSOP (0.240, 6.10mm Width)

Datasheet:: CLVTH162245IDGGREP.pdf

Description:: IC TXRX NON-INVERT 3.6V 48TSSOP

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Application Scenarios

What Applications Is CLVTH162245IDGGREP Suitable For?

CLVTH162245IDGGREP is a Logic - Buffers, Drivers, Receivers, Transceivers product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Logic - Buffers, Drivers, Receivers, Transceivers components. Engineers can review the CLVTH162245IDGGREP datasheet, package 48-TFSOP (0.240, 6.10mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate CLVTH162245IDGGREP specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the CLVTH162245IDGGREP description, package 48-TFSOP (0.240, 6.10mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports CLVTH162245IDGGREP datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for CLVTH162245IDGGREP Pricing & Technical Support

Product Overview

CLVTH162245IDGGREP is a Logic - Buffers, Drivers, Receivers, Transceivers product from Texas Instruments. It is supplied in package 48-TFSOP (0.240, 6.10mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide CLVTH162245IDGGREP datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC TXRX NON-INVERT 3.6V 48TSSOP

Key Features

Part Number:CLVTH162245IDGGREP
Manufacturer:Texas Instruments
Category:Logic - Buffers, Drivers, Receivers, Transceivers
Package:48-TFSOP (0.240, 6.10mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

CLVTH162245IDGGREP may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for CLVTH162245IDGGREP stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

48-TFSOP (0.240, 6.10mm Width)
Packaging:

Tape & Reel (TR),Cut Tape (CT),Bulk
Series:

74LVTH
ProductStatus:

Active
LogicType:

Transceiver, Non-Inverting
NumberofElements:

2
NumberofBitsperElement:

8
InputType:

-
OutputType:

3-State
Current-OutputHighLow:

12mA, 12mA; 32mA, 64mA
Voltage-Supply:

2.7V ~ 3.6V
OperatingTemperature:

-40°C ~ 85°C (TA)
MountingType:

Surface Mount
Category:

Logic - Buffers, Drivers, Receivers, Transceivers
Datasheet:

CLVTH162245IDGGREP.pdf

CLVTH162245IDGGREP Frequently Asked Questions

Is CLVTH162245IDGGREP currently in stock? ▼

FudongIC currently shows 2,421 units of CLVTH162245IDGGREP in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for CLVTH162245IDGGREP? ▼

The minimum order quantity currently shown for CLVTH162245IDGGREP is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is CLVTH162245IDGGREP original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for CLVTH162245IDGGREP, please note this in your RFQ.

Can you provide a datasheet or technical support for CLVTH162245IDGGREP? ▼

Yes. You can view or download the CLVTH162245IDGGREP.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for CLVTH162245IDGGREP, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for CLVTH162245IDGGREP? ▼

Yes. Based on your application, preferred manufacturer, package 48-TFSOP (0.240, 6.10mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for CLVTH162245IDGGREP. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use CLVTH162245IDGGREP? ▼

As a Logic - Buffers, Drivers, Receivers, Transceivers product from Texas Instruments, CLVTH162245IDGGREP may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.