All Categories

View More Product Categories >>

CPV363M4F Vishay General Semiconductor - Diodes Division

Part No.:: CPV363M4F

Manufacturer:: Vishay General Semiconductor - Diodes Division

Category:: Transistors - IGBTs - Modules

Package:: 19-SIP (13 Leads), IMS-2

Datasheet:: CPV363M4F.pdf

Description:: IGBT MODULE 600V 16A 36W IMS-2

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is CPV363M4F Suitable For?

CPV363M4F is a Transistors - IGBTs - Modules product from Vishay General Semiconductor - Diodes Division, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - IGBTs - Modules components. Engineers can review the CPV363M4F datasheet, package 19-SIP (13 Leads), IMS-2 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Vishay General Semiconductor - Diodes Division components are required, helping engineers evaluate CPV363M4F specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the CPV363M4F description, package 19-SIP (13 Leads), IMS-2 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports CPV363M4F datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for CPV363M4F Pricing & Technical Support

Product Overview

CPV363M4F is a Transistors - IGBTs - Modules product from Vishay General Semiconductor - Diodes Division. It is supplied in package 19-SIP (13 Leads), IMS-2 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide CPV363M4F datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IGBT MODULE 600V 16A 36W IMS-2

Key Features

Part Number:CPV363M4F
Manufacturer:Vishay General Semiconductor - Diodes Division
Category:Transistors - IGBTs - Modules
Package:19-SIP (13 Leads), IMS-2
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

CPV363M4F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for CPV363M4F stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

-
Series:

-
ProductStatus:

Obsolete
IGBTType:

-
Configuration:

Three Phase Inverter
Voltage-CollectorEmitterBreakdown(Max):

600 V
Current-Collector(Ic)(Max):

16 A
Power-Max:

36 W
Vce(on)(Max)@VgeIc:

1.63V @ 15V, 16A
Current-CollectorCutoff(Max):

250 µA
InputCapacitance(Cies)@Vce:

1.1 nF @ 30 V
Input:

Standard
NTCThermistor:

No
OperatingTemperature:

-40°C ~ 150°C (TJ)
MountingType:

Through Hole
Category:

Transistors - IGBTs - Modules
Datasheet:

CPV363M4F.pdf

CPV363M4F Frequently Asked Questions

Is CPV363M4F currently in stock? ▼

FudongIC currently shows 2,796 units of CPV363M4F in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for CPV363M4F? ▼

The minimum order quantity currently shown for CPV363M4F is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is CPV363M4F original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for CPV363M4F, please note this in your RFQ.

Can you provide a datasheet or technical support for CPV363M4F? ▼

Yes. You can view or download the CPV363M4F.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for CPV363M4F, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for CPV363M4F? ▼

Yes. Based on your application, preferred manufacturer, package 19-SIP (13 Leads), IMS-2, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for CPV363M4F. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use CPV363M4F? ▼

As a Transistors - IGBTs - Modules product from Vishay General Semiconductor - Diodes Division, CPV363M4F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.