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D-300-08CS1108 TE Connectivity Aerospace, Defense and Marine

Part No.:: D-300-08CS1108

Manufacturer:: TE Connectivity Aerospace, Defense and Marine

Category:: Heat Shrink Boots, Caps

Package:

Datasheet:: D-300-08CS1108.pdf

Description:: HEATSHRINK CAP FOR SPLICE .17

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

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Application Scenarios

What Applications Is D-300-08CS1108 Suitable For?

D-300-08CS1108 is a Heat Shrink Boots, Caps product from TE Connectivity Aerospace, Defense and Marine, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Heat Shrink Boots, Caps components. Engineers can review the D-300-08CS1108 datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original TE Connectivity Aerospace, Defense and Marine components are required, helping engineers evaluate D-300-08CS1108 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the D-300-08CS1108 description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports D-300-08CS1108 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for D-300-08CS1108 Pricing & Technical Support

Product Overview

D-300-08CS1108 is a Heat Shrink Boots, Caps product from TE Connectivity Aerospace, Defense and Marine. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide D-300-08CS1108 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: HEATSHRINK CAP FOR SPLICE .17

Key Features

Part Number:D-300-08CS1108
Manufacturer:TE Connectivity Aerospace, Defense and Marine
Category:Heat Shrink Boots, Caps
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

D-300-08CS1108 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for D-300-08CS1108 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

D-300
ProductStatus:

Active
Type:

Cap, Splice Encapsulation
ShellSize-Insert:

-
Features:

-
Color:

-
Material:

Polyolefin (PO), Irradiated
LargeDiameterSupplied:

0.170 (4.32mm)
LargeDiameterRecovered:

0.080 (2.03mm)
SmallDiameterSupplied:

-
SmallDiameterRecovered:

-
LargeRecoveredLength:

-
SmallRecoveredLength:

-
TotalLengthSupplied:

1.000 (25.40mm)
Category:

Heat Shrink Boots, Caps
Datasheet:

D-300-08CS1108.pdf

D-300-08CS1108 Frequently Asked Questions

Is D-300-08CS1108 currently in stock? ▼

FudongIC currently shows 689 units of D-300-08CS1108 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for D-300-08CS1108? ▼

The minimum order quantity currently shown for D-300-08CS1108 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is D-300-08CS1108 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for D-300-08CS1108, please note this in your RFQ.

Can you provide a datasheet or technical support for D-300-08CS1108? ▼

Yes. You can view or download the D-300-08CS1108.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for D-300-08CS1108, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for D-300-08CS1108? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for D-300-08CS1108. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use D-300-08CS1108? ▼

As a Heat Shrink Boots, Caps product from TE Connectivity Aerospace, Defense and Marine, D-300-08CS1108 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.