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DCK-3R3E404T-E Elna America

Part No.:: DCK-3R3E404T-E

Manufacturer:: Elna America

Category:: Electric Double Layer Capacitors (EDLC), Supercapacitors

Package:: Coin, Thin Terminals - Same Sides

Datasheet:: DCK-3R3E404T-E.pdf

Description:: CAP 200MF -20% +80% 3.3V SMD

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is DCK-3R3E404T-E Suitable For?

DCK-3R3E404T-E is a Electric Double Layer Capacitors (EDLC), Supercapacitors product from Elna America, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Electric Double Layer Capacitors (EDLC), Supercapacitors components. Engineers can review the DCK-3R3E404T-E datasheet, package Coin, Thin Terminals - Same Sides and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Elna America components are required, helping engineers evaluate DCK-3R3E404T-E specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the DCK-3R3E404T-E description, package Coin, Thin Terminals - Same Sides and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports DCK-3R3E404T-E datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for DCK-3R3E404T-E Pricing & Technical Support

Product Overview

DCK-3R3E404T-E is a Electric Double Layer Capacitors (EDLC), Supercapacitors product from Elna America. It is supplied in package Coin, Thin Terminals - Same Sides and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide DCK-3R3E404T-E datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CAP 200MF -20% +80% 3.3V SMD

Key Features

Part Number:DCK-3R3E404T-E
Manufacturer:Elna America
Category:Electric Double Layer Capacitors (EDLC), Supercapacitors
Package:Coin, Thin Terminals - Same Sides
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

DCK-3R3E404T-E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for DCK-3R3E404T-E stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

Coin, Thin Terminals - Same Sides
Packaging:

Bag
Series:

DCK
ProductStatus:

Obsolete
Capacitance:

400 mF
Tolerance:

-20%, +80%
Voltage-Rated:

3.3 V
ESR(EquivalentSeriesResistance):

200Ohm @ 1kHz
Lifetime@Temp:

500 Hrs @ 60°C
Termination:

SMD (SMT) Tabs
MountingType:

Surface Mount
LeadSpacing:

-
Size/Dimension:

0.268 Dia (6.80mm)
Height-Seated(Max):

0.083 (2.10mm)
Category:

Electric Double Layer Capacitors (EDLC), Supercapacitors
Datasheet:

DCK-3R3E404T-E.pdf

DCK-3R3E404T-E Frequently Asked Questions

Is DCK-3R3E404T-E currently in stock? ▼

FudongIC currently shows 2,048 units of DCK-3R3E404T-E in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for DCK-3R3E404T-E? ▼

The minimum order quantity currently shown for DCK-3R3E404T-E is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is DCK-3R3E404T-E original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for DCK-3R3E404T-E, please note this in your RFQ.

Can you provide a datasheet or technical support for DCK-3R3E404T-E? ▼

Yes. You can view or download the DCK-3R3E404T-E.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for DCK-3R3E404T-E, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for DCK-3R3E404T-E? ▼

Yes. Based on your application, preferred manufacturer, package Coin, Thin Terminals - Same Sides, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for DCK-3R3E404T-E. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use DCK-3R3E404T-E? ▼

As a Electric Double Layer Capacitors (EDLC), Supercapacitors product from Elna America, DCK-3R3E404T-E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.