All Categories

View More Product Categories >>

DRA829JMTGBALFR Texas Instruments

Part No.:: DRA829JMTGBALFR

Manufacturer:: Texas Instruments

Category:: Embedded - System On Chip (SoC)

Package:: 827-BFBGA, FCBGA

Datasheet:: DRA829JMTGBALFR.pdf

Description:: DUAL ARM CORTEX-A72, QUAD CORTEX

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is DRA829JMTGBALFR Suitable For?

DRA829JMTGBALFR is a Embedded - System On Chip (SoC) product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - System On Chip (SoC) components. Engineers can review the DRA829JMTGBALFR datasheet, package 827-BFBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate DRA829JMTGBALFR specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the DRA829JMTGBALFR description, package 827-BFBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports DRA829JMTGBALFR datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for DRA829JMTGBALFR Pricing & Technical Support

Product Overview

DRA829JMTGBALFR is a Embedded - System On Chip (SoC) product from Texas Instruments. It is supplied in package 827-BFBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide DRA829JMTGBALFR datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: DUAL ARM CORTEX-A72, QUAD CORTEX

Key Features

Part Number:DRA829JMTGBALFR
Manufacturer:Texas Instruments
Category:Embedded - System On Chip (SoC)
Package:827-BFBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

DRA829JMTGBALFR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for DRA829JMTGBALFR stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

827-BFBGA, FCBGA
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
Architecture:

DSP, MCU, MPU
CoreProcessor:

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
FlashSize:

-
RAMSize:

1.5MB
Peripherals:

DMA, PWM, WDT
Connectivity:

I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed:

2GHz, 1GHz, 1.35GHz, 1GHz
PrimaryAttributes:

-
OperatingTemperature:

-40°C ~ 105°C (TJ)
Category:

Embedded - System On Chip (SoC)
Datasheet:

DRA829JMTGBALFR.pdf

DRA829JMTGBALFR Frequently Asked Questions

Is DRA829JMTGBALFR currently in stock? ▼

FudongIC currently shows 2,957 units of DRA829JMTGBALFR in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for DRA829JMTGBALFR? ▼

The minimum order quantity currently shown for DRA829JMTGBALFR is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is DRA829JMTGBALFR original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for DRA829JMTGBALFR, please note this in your RFQ.

Can you provide a datasheet or technical support for DRA829JMTGBALFR? ▼

Yes. You can view or download the DRA829JMTGBALFR.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for DRA829JMTGBALFR, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for DRA829JMTGBALFR? ▼

Yes. Based on your application, preferred manufacturer, package 827-BFBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for DRA829JMTGBALFR. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use DRA829JMTGBALFR? ▼

As a Embedded - System On Chip (SoC) product from Texas Instruments, DRA829JMTGBALFR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.