DS1629S.pdf
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DS1629S is a PMIC - Thermal Management product from Analog Devices Inc./Maxim Integrated, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.
Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Thermal Management components. Engineers can review the DS1629S datasheet, package 8-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.
Suitable for automotive, ADAS and vehicle-control systems where original Analog Devices Inc./Maxim Integrated components are required, helping engineers evaluate DS1629S specifications, pricing and supply lead time.
Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the DS1629S description, package 8-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.
Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports DS1629S datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.
FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.
Contact FudongIC for DS1629S Pricing & Technical SupportDS1629S is a PMIC - Thermal Management product from Analog Devices Inc./Maxim Integrated. It is supplied in package 8-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide DS1629S datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.
Product Description: IC THERM/RTC/CALENDAR DIG 8-SOIC
DS1629S may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.
If you are looking for DS1629S stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.
FudongIC currently shows 3,521 units of DS1629S in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.
The minimum order quantity currently shown for DS1629S is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.
FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for DS1629S, please note this in your RFQ.
Yes. You can view or download the DS1629S.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for DS1629S, you can also contact the FudongIC technical and sales team.
Yes. Based on your application, preferred manufacturer, package 8-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for DS1629S. Please submit an RFQ with your original BOM or specification requirements.
As a PMIC - Thermal Management product from Analog Devices Inc./Maxim Integrated, DS1629S may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.
8-WFDFN Exposed Pad
MOD TEMP SENSOR 4KB EEP 8TDFN
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