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DS89C386TMEA/NOPB National Semiconductor

Part No.:: DS89C386TMEA/NOPB

Manufacturer:: National Semiconductor

Category:: Interface - Drivers, Receivers, Transceivers

Package:: 48-BSSOP (0.295, 7.50mm Width)

Datasheet:: DS89C386TMEA/NOPB.pdf

Description:: IC LINE REC CMOS DIF 12CH 48SSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is DS89C386TMEA/NOPB Suitable For?

DS89C386TMEA/NOPB is a Interface - Drivers, Receivers, Transceivers product from National Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Drivers, Receivers, Transceivers components. Engineers can review the DS89C386TMEA/NOPB datasheet, package 48-BSSOP (0.295, 7.50mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original National Semiconductor components are required, helping engineers evaluate DS89C386TMEA/NOPB specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the DS89C386TMEA/NOPB description, package 48-BSSOP (0.295, 7.50mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports DS89C386TMEA/NOPB datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for DS89C386TMEA/NOPB Pricing & Technical Support

Product Overview

DS89C386TMEA/NOPB is a Interface - Drivers, Receivers, Transceivers product from National Semiconductor. It is supplied in package 48-BSSOP (0.295, 7.50mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide DS89C386TMEA/NOPB datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC LINE REC CMOS DIF 12CH 48SSOP

Key Features

Part Number:DS89C386TMEA/NOPB
Manufacturer:National Semiconductor
Category:Interface - Drivers, Receivers, Transceivers
Package:48-BSSOP (0.295, 7.50mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

DS89C386TMEA/NOPB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for DS89C386TMEA/NOPB stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

48-BSSOP (0.295, 7.50mm Width)
Packaging:

Bulk
Series:

-
ProductStatus:

Active
Type:

Receiver
Protocol:

RS422, RS423
NumberofDrivers/Receivers:

0/12
Duplex:

-
ReceiverHysteresis:

70 mV
DataRate:

-
Voltage-Supply:

4.5V ~ 5.5V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - Drivers, Receivers, Transceivers
Datasheet:

DS89C386TMEA/NOPB.pdf

DS89C386TMEA/NOPB Frequently Asked Questions

Is DS89C386TMEA/NOPB currently in stock? ▼

FudongIC currently shows 2,880 units of DS89C386TMEA/NOPB in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for DS89C386TMEA/NOPB? ▼

The minimum order quantity currently shown for DS89C386TMEA/NOPB is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is DS89C386TMEA/NOPB original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for DS89C386TMEA/NOPB, please note this in your RFQ.

Can you provide a datasheet or technical support for DS89C386TMEA/NOPB? ▼

Yes. You can view or download the DS89C386TMEA/NOPB.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for DS89C386TMEA/NOPB, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for DS89C386TMEA/NOPB? ▼

Yes. Based on your application, preferred manufacturer, package 48-BSSOP (0.295, 7.50mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for DS89C386TMEA/NOPB. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use DS89C386TMEA/NOPB? ▼

As a Interface - Drivers, Receivers, Transceivers product from National Semiconductor, DS89C386TMEA/NOPB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.