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EEE-HAE331UAP Panasonic Electronic Components

Part No.:: EEE-HAE331UAP

Manufacturer:: Panasonic Electronic Components

Category:: Aluminum Electrolytic Capacitors

Package:

Datasheet:: EEE-HAE331UAP.pdf

Description:: CAP ALUM 330UF 20% 25V SMD

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is EEE-HAE331UAP Suitable For?

EEE-HAE331UAP is a Aluminum Electrolytic Capacitors product from Panasonic Electronic Components, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Aluminum Electrolytic Capacitors components. Engineers can review the EEE-HAE331UAP datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Panasonic Electronic Components components are required, helping engineers evaluate EEE-HAE331UAP specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the EEE-HAE331UAP description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports EEE-HAE331UAP datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for EEE-HAE331UAP Pricing & Technical Support

Product Overview

EEE-HAE331UAP is a Aluminum Electrolytic Capacitors product from Panasonic Electronic Components. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide EEE-HAE331UAP datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CAP ALUM 330UF 20% 25V SMD

Key Features

Part Number:EEE-HAE331UAP
Manufacturer:Panasonic Electronic Components
Category:Aluminum Electrolytic Capacitors
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

EEE-HAE331UAP may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for EEE-HAE331UAP stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

HA
ProductStatus:

Active
Capacitance:

330 µF
Tolerance:

±20%
Voltage-Rated:

25 V
ESR(EquivalentSeriesResistance):

-
Lifetime@Temp:

1000 Hrs @ 105°C
OperatingTemperature:

-40°C ~ 105°C
Polarization:

Polar
Ratings:

AEC-Q200
Applications:

Automotive
RippleCurrent@LowFrequency:

180 mA @ 120 Hz
RippleCurrent@HighFrequency:

306 mA @ 10 kHz
Impedance:

-
LeadSpacing:

-
Size/Dimension:

0.315 Dia (8.00mm)
Height-Seated(Max):

0.402 (10.20mm)
SurfaceMountLandSize:

0.327 L x 0.327 W (8.30mm x 8.30mm)
MountingType:

Surface Mount
Category:

Aluminum Electrolytic Capacitors
Datasheet:

EEE-HAE331UAP.pdf

EEE-HAE331UAP Frequently Asked Questions

Is EEE-HAE331UAP currently in stock? ▼

FudongIC currently shows 12,089 units of EEE-HAE331UAP in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for EEE-HAE331UAP? ▼

The minimum order quantity currently shown for EEE-HAE331UAP is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is EEE-HAE331UAP original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for EEE-HAE331UAP, please note this in your RFQ.

Can you provide a datasheet or technical support for EEE-HAE331UAP? ▼

Yes. You can view or download the EEE-HAE331UAP.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for EEE-HAE331UAP, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for EEE-HAE331UAP? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for EEE-HAE331UAP. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use EEE-HAE331UAP? ▼

As a Aluminum Electrolytic Capacitors product from Panasonic Electronic Components, EEE-HAE331UAP may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.