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EZR32HG220F64R63G-C0R Silicon Labs

Part No.:: EZR32HG220F64R63G-C0R

Manufacturer:: Silicon Labs

Category:: RF Transceiver ICs

Package:: 48-VFQFN Exposed Pad

Datasheet:: EZR32HG220F64R63G-C0R.pdf

Description:: 64 KB M0+ +20 DBM EZRADIOPRO QFN

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is EZR32HG220F64R63G-C0R Suitable For?

EZR32HG220F64R63G-C0R is a RF Transceiver ICs product from Silicon Labs, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable RF Transceiver ICs components. Engineers can review the EZR32HG220F64R63G-C0R datasheet, package 48-VFQFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Silicon Labs components are required, helping engineers evaluate EZR32HG220F64R63G-C0R specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the EZR32HG220F64R63G-C0R description, package 48-VFQFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports EZR32HG220F64R63G-C0R datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for EZR32HG220F64R63G-C0R Pricing & Technical Support

Product Overview

EZR32HG220F64R63G-C0R is a RF Transceiver ICs product from Silicon Labs. It is supplied in package 48-VFQFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide EZR32HG220F64R63G-C0R datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: 64 KB M0+ +20 DBM EZRADIOPRO QFN

Key Features

Part Number:EZR32HG220F64R63G-C0R
Manufacturer:Silicon Labs
Category:RF Transceiver ICs
Package:48-VFQFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

EZR32HG220F64R63G-C0R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for EZR32HG220F64R63G-C0R stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

EZR32HG
ProductStatus:

Active
Type:

TxRx + MCU
RFFamily/Standard:

802.15.4
Protocol:

-
Modulation:

4GFSK, GFSK, GMSK, OOK
Frequency:

142MHz ~ 1.05GHz
DataRate(Max):

1Mbps
Power-Output:

20dBm
Sensitivity:

-126dBm
MemorySize:

64kB Flash, 8kB RAM
SerialInterfaces:

I²C, SPI, UART, USART, USB
GPIO:

27
Voltage-Supply:

1.98V ~ 3.8V
Current-Receiving:

11.1mA ~ 13.7mA
Current-Transmitting:

44.5mA ~ 93mA
OperatingTemperature:

-40°C ~ 85°C (TA)
MountingType:

Surface Mount
Category:

RF Transceiver ICs
Datasheet:

EZR32HG220F64R63G-C0R.pdf

EZR32HG220F64R63G-C0R Frequently Asked Questions

Is EZR32HG220F64R63G-C0R currently in stock? ▼

FudongIC currently shows 2,332 units of EZR32HG220F64R63G-C0R in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for EZR32HG220F64R63G-C0R? ▼

The minimum order quantity currently shown for EZR32HG220F64R63G-C0R is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is EZR32HG220F64R63G-C0R original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for EZR32HG220F64R63G-C0R, please note this in your RFQ.

Can you provide a datasheet or technical support for EZR32HG220F64R63G-C0R? ▼

Yes. You can view or download the EZR32HG220F64R63G-C0R.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for EZR32HG220F64R63G-C0R, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for EZR32HG220F64R63G-C0R? ▼

Yes. Based on your application, preferred manufacturer, package 48-VFQFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for EZR32HG220F64R63G-C0R. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use EZR32HG220F64R63G-C0R? ▼

As a RF Transceiver ICs product from Silicon Labs, EZR32HG220F64R63G-C0R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.