All Categories

View More Product Categories >>

FIN1102MTC onsemi

Part No.:: FIN1102MTC

Manufacturer:: onsemi

Category:: Interface - Signal Buffers, Repeaters, Splitters

Package:: 14-TSSOP (0.173, 4.40mm Width)

Datasheet:: FIN1102MTC.pdf

Description:: IC REDRIVER LVDS 2CH 14TSSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is FIN1102MTC Suitable For?

FIN1102MTC is a Interface - Signal Buffers, Repeaters, Splitters product from onsemi, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Signal Buffers, Repeaters, Splitters components. Engineers can review the FIN1102MTC datasheet, package 14-TSSOP (0.173, 4.40mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original onsemi components are required, helping engineers evaluate FIN1102MTC specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the FIN1102MTC description, package 14-TSSOP (0.173, 4.40mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports FIN1102MTC datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for FIN1102MTC Pricing & Technical Support

Product Overview

FIN1102MTC is a Interface - Signal Buffers, Repeaters, Splitters product from onsemi. It is supplied in package 14-TSSOP (0.173, 4.40mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide FIN1102MTC datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC REDRIVER LVDS 2CH 14TSSOP

Key Features

Part Number:FIN1102MTC
Manufacturer:onsemi
Category:Interface - Signal Buffers, Repeaters, Splitters
Package:14-TSSOP (0.173, 4.40mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

FIN1102MTC may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for FIN1102MTC stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

14-TSSOP (0.173, 4.40mm Width)
Packaging:

Tube
Series:

-
ProductStatus:

Obsolete
Type:

Buffer, ReDriver
Applications:

LVDS
Input:

LVDS, LVPECL
Output:

LVDS
DataRate(Max):

800Mbps
NumberofChannels:

2
DelayTime:

1.75ns
SignalConditioning:

-
Capacitance-Input:

2.5 pF
Voltage-Supply:

3V ~ 3.6V
Current-Supply:

23mA
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - Signal Buffers, Repeaters, Splitters
Datasheet:

FIN1102MTC.pdf

FIN1102MTC Frequently Asked Questions

Is FIN1102MTC currently in stock? ▼

FudongIC currently shows 3,063 units of FIN1102MTC in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for FIN1102MTC? ▼

The minimum order quantity currently shown for FIN1102MTC is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is FIN1102MTC original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for FIN1102MTC, please note this in your RFQ.

Can you provide a datasheet or technical support for FIN1102MTC? ▼

Yes. You can view or download the FIN1102MTC.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for FIN1102MTC, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for FIN1102MTC? ▼

Yes. Based on your application, preferred manufacturer, package 14-TSSOP (0.173, 4.40mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for FIN1102MTC. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use FIN1102MTC? ▼

As a Interface - Signal Buffers, Repeaters, Splitters product from onsemi, FIN1102MTC may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.