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GD25Q127CWIGR GigaDevice Semiconductor (HK) Limited

Part No.:: GD25Q127CWIGR

Manufacturer:: GigaDevice Semiconductor (HK) Limited

Category:: Memory

Package:: 8-WDFN Exposed Pad

Datasheet:: GD25Q127CWIGR.pdf

Description:: IC FLASH 128MBIT SPI/QUAD 8WSON

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is GD25Q127CWIGR Suitable For?

GD25Q127CWIGR is a Memory product from GigaDevice Semiconductor (HK) Limited, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Memory components. Engineers can review the GD25Q127CWIGR datasheet, package 8-WDFN Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original GigaDevice Semiconductor (HK) Limited components are required, helping engineers evaluate GD25Q127CWIGR specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the GD25Q127CWIGR description, package 8-WDFN Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports GD25Q127CWIGR datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for GD25Q127CWIGR Pricing & Technical Support

Product Overview

GD25Q127CWIGR is a Memory product from GigaDevice Semiconductor (HK) Limited. It is supplied in package 8-WDFN Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide GD25Q127CWIGR datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC FLASH 128MBIT SPI/QUAD 8WSON

Key Features

Part Number:GD25Q127CWIGR
Manufacturer:GigaDevice Semiconductor (HK) Limited
Category:Memory
Package:8-WDFN Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

GD25Q127CWIGR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for GD25Q127CWIGR stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Not For New Designs
MemoryType:

Non-Volatile
MemoryFormat:

FLASH
Technology:

FLASH - NOR
MemorySize:

128Mb (16M x 8)
MemoryInterface:

SPI - Quad I/O
ClockFrequency:

104 MHz
WriteCycleTime-WordPage:

12µs, 2.4ms
AccessTime:

-
Voltage-Supply:

2.7V ~ 3.6V
OperatingTemperature:

-40°C ~ 85°C (TA)
MountingType:

Surface Mount
Category:

Memory
Datasheet:

GD25Q127CWIGR.pdf

GD25Q127CWIGR Frequently Asked Questions

Is GD25Q127CWIGR currently in stock? ▼

FudongIC currently shows 3,551 units of GD25Q127CWIGR in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for GD25Q127CWIGR? ▼

The minimum order quantity currently shown for GD25Q127CWIGR is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is GD25Q127CWIGR original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for GD25Q127CWIGR, please note this in your RFQ.

Can you provide a datasheet or technical support for GD25Q127CWIGR? ▼

Yes. You can view or download the GD25Q127CWIGR.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for GD25Q127CWIGR, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for GD25Q127CWIGR? ▼

Yes. Based on your application, preferred manufacturer, package 8-WDFN Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for GD25Q127CWIGR. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use GD25Q127CWIGR? ▼

As a Memory product from GigaDevice Semiconductor (HK) Limited, GD25Q127CWIGR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.