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GO 10-SME/SP3 KIT 5P LEM USA Inc.

Part No.:: GO 10-SME/SP3 KIT 5P

Manufacturer:: LEM USA Inc.

Category:: Current Transducers

Package:: 8-SOIC (0.154, 3.90mm Width)

Datasheet:: GO 10-SME/SP3 KIT 5P.pdf

Description:: CURRENT TRANSDUCER KIT

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is GO 10-SME/SP3 KIT 5P Suitable For?

GO 10-SME/SP3 KIT 5P is a Current Transducers product from LEM USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Current Transducers components. Engineers can review the GO 10-SME/SP3 KIT 5P datasheet, package 8-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original LEM USA Inc. components are required, helping engineers evaluate GO 10-SME/SP3 KIT 5P specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the GO 10-SME/SP3 KIT 5P description, package 8-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports GO 10-SME/SP3 KIT 5P datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for GO 10-SME/SP3 KIT 5P Pricing & Technical Support

Product Overview

GO 10-SME/SP3 KIT 5P is a Current Transducers product from LEM USA Inc.. It is supplied in package 8-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide GO 10-SME/SP3 KIT 5P datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CURRENT TRANSDUCER KIT

Key Features

Part Number:GO 10-SME/SP3 KIT 5P
Manufacturer:LEM USA Inc.
Category:Current Transducers
Package:8-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

GO 10-SME/SP3 KIT 5P may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for GO 10-SME/SP3 KIT 5P stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

GO-SME
ProductStatus:

Discontinued at Mosen
ForMeasuring:

AC/DC
SensorType:

Hall Effect
Current-Sensing:

10A
NumberofChannels:

1
Output:

Ratiometric, Voltage
Sensitivity:

80mV/A
Frequency:

DC ~ 300kHz
Linearity:

±0.3%
Accuracy:

±1.3%
Voltage-Supply:

3.135V ~ 3.465V
ResponseTime:

2µs
Current-Supply(Max):

26mA
OperatingTemperature:

-40°C ~ 125°C (TA)
Polarization:

Bidirectional
MountingType:

Surface Mount
Category:

Current Transducers
Datasheet:

GO 10-SME/SP3 KIT 5P.pdf

GO 10-SME/SP3 KIT 5P Frequently Asked Questions

Is GO 10-SME/SP3 KIT 5P currently in stock? ▼

FudongIC currently shows 2,300 units of GO 10-SME/SP3 KIT 5P in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for GO 10-SME/SP3 KIT 5P? ▼

The minimum order quantity currently shown for GO 10-SME/SP3 KIT 5P is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is GO 10-SME/SP3 KIT 5P original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for GO 10-SME/SP3 KIT 5P, please note this in your RFQ.

Can you provide a datasheet or technical support for GO 10-SME/SP3 KIT 5P? ▼

Yes. You can view or download the GO 10-SME/SP3 KIT 5P.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for GO 10-SME/SP3 KIT 5P, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for GO 10-SME/SP3 KIT 5P? ▼

Yes. Based on your application, preferred manufacturer, package 8-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for GO 10-SME/SP3 KIT 5P. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use GO 10-SME/SP3 KIT 5P? ▼

As a Current Transducers product from LEM USA Inc., GO 10-SME/SP3 KIT 5P may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.