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GPTGP7000ULM-0.040-02-0808 Bergquist

Part No.:: GPTGP7000ULM-0.040-02-0808

Manufacturer:: Bergquist

Category:: Thermal - Pads, Sheets

Package:

Datasheet:: GPTGP7000ULM-0.040-02-0808.pdf

Description:: GAP PAD 8X8 SHEET 0.040

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is GPTGP7000ULM-0.040-02-0808 Suitable For?

GPTGP7000ULM-0.040-02-0808 is a Thermal - Pads, Sheets product from Bergquist, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Pads, Sheets components. Engineers can review the GPTGP7000ULM-0.040-02-0808 datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Bergquist components are required, helping engineers evaluate GPTGP7000ULM-0.040-02-0808 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the GPTGP7000ULM-0.040-02-0808 description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports GPTGP7000ULM-0.040-02-0808 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for GPTGP7000ULM-0.040-02-0808 Pricing & Technical Support

Product Overview

GPTGP7000ULM-0.040-02-0808 is a Thermal - Pads, Sheets product from Bergquist. It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide GPTGP7000ULM-0.040-02-0808 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: GAP PAD 8X8 SHEET 0.040

Key Features

Part Number:GPTGP7000ULM-0.040-02-0808
Manufacturer:Bergquist
Category:Thermal - Pads, Sheets
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

GPTGP7000ULM-0.040-02-0808 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for GPTGP7000ULM-0.040-02-0808 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Box
Series:

Gap Pad® 7000ULM
ProductStatus:

Active
Usage:

-
Type:

Gap Filler Pad, Sheet
Shape:

Square
Outline:

203.20mm x 203.20mm
Thickness:

0.0400 (1.016mm)
Material:

Silicone
Adhesive:

Tacky - Both Sides
BackingCarrier:

-
Color:

Gray
ThermalResistivity:

-
Category:

Thermal - Pads, Sheets
Datasheet:

GPTGP7000ULM-0.040-02-0808.pdf

GPTGP7000ULM-0.040-02-0808 Frequently Asked Questions

Is GPTGP7000ULM-0.040-02-0808 currently in stock? ▼

FudongIC currently shows 2,230 units of GPTGP7000ULM-0.040-02-0808 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for GPTGP7000ULM-0.040-02-0808? ▼

The minimum order quantity currently shown for GPTGP7000ULM-0.040-02-0808 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is GPTGP7000ULM-0.040-02-0808 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for GPTGP7000ULM-0.040-02-0808, please note this in your RFQ.

Can you provide a datasheet or technical support for GPTGP7000ULM-0.040-02-0808? ▼

Yes. You can view or download the GPTGP7000ULM-0.040-02-0808.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for GPTGP7000ULM-0.040-02-0808, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for GPTGP7000ULM-0.040-02-0808? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for GPTGP7000ULM-0.040-02-0808. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use GPTGP7000ULM-0.040-02-0808? ▼

As a Thermal - Pads, Sheets product from Bergquist, GPTGP7000ULM-0.040-02-0808 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.