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HFA1305IB Intersil

Part No.:: HFA1305IB

Manufacturer:: Intersil

Category:: Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Package:: 14-SOIC (0.154, 3.90mm Width)

Datasheet:: HFA1305IB.pdf

Description:: IC OPAMP CFA 3 CIRCUIT 14SOIC

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is HFA1305IB Suitable For?

HFA1305IB is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Intersil, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps components. Engineers can review the HFA1305IB datasheet, package 14-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Intersil components are required, helping engineers evaluate HFA1305IB specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HFA1305IB description, package 14-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HFA1305IB datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HFA1305IB Pricing & Technical Support

Product Overview

HFA1305IB is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Intersil. It is supplied in package 14-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HFA1305IB datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC OPAMP CFA 3 CIRCUIT 14SOIC

Key Features

Part Number:HFA1305IB
Manufacturer:Intersil
Category:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Package:14-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HFA1305IB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HFA1305IB stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

14-SOIC (0.154, 3.90mm Width)
Packaging:

Bulk
Series:

-
ProductStatus:

Obsolete
AmplifierType:

Current Feedback
NumberofCircuits:

3
OutputType:

-
SlewRate:

2500V/µs
GainBandwidthProduct:

-
-3dbBandwidth:

375 MHz
Current-InputBias:

6 µA
Voltage-InputOffset:

2 mV
Current-Supply:

5.8mA
Current-Output/Channel:

60 mA
Voltage-SupplySpan(Min):

9 V
Voltage-SupplySpan(Max):

11 V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet:

HFA1305IB.pdf

HFA1305IB Frequently Asked Questions

Is HFA1305IB currently in stock? ▼

FudongIC currently shows 3,006 units of HFA1305IB in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HFA1305IB? ▼

The minimum order quantity currently shown for HFA1305IB is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HFA1305IB original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HFA1305IB, please note this in your RFQ.

Can you provide a datasheet or technical support for HFA1305IB? ▼

Yes. You can view or download the HFA1305IB.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HFA1305IB, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HFA1305IB? ▼

Yes. Based on your application, preferred manufacturer, package 14-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HFA1305IB. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HFA1305IB? ▼

As a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product from Intersil, HFA1305IB may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.