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HFA3767IA Harris Corporation

Part No.:: HFA3767IA

Manufacturer:: Harris Corporation

Category:: RF Misc ICs and Modules

Package:: 20-SSOP (0.154, 3.90mm Width)

Datasheet:: HFA3767IA.pdf

Description:: 130MHZ CDMA/AMPS QUADRATURE MODU

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Application Scenarios

What Applications Is HFA3767IA Suitable For?

HFA3767IA is a RF Misc ICs and Modules product from Harris Corporation, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable RF Misc ICs and Modules components. Engineers can review the HFA3767IA datasheet, package 20-SSOP (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Harris Corporation components are required, helping engineers evaluate HFA3767IA specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HFA3767IA description, package 20-SSOP (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HFA3767IA datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HFA3767IA Pricing & Technical Support

Product Overview

HFA3767IA is a RF Misc ICs and Modules product from Harris Corporation. It is supplied in package 20-SSOP (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HFA3767IA datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: 130MHZ CDMA/AMPS QUADRATURE MODU

Key Features

Part Number:HFA3767IA
Manufacturer:Harris Corporation
Category:RF Misc ICs and Modules
Package:20-SSOP (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HFA3767IA may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HFA3767IA stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Active
Function:

Modulator
Frequency:

130MHz
RFType:

AMPS, CDMA, TDMA
SecondaryAttributes:

Up Converter
MountingType:

Surface Mount
Category:

RF Misc ICs and Modules
Datasheet:

HFA3767IA.pdf

HFA3767IA Frequently Asked Questions

Is HFA3767IA currently in stock? ▼

FudongIC currently shows 912 units of HFA3767IA in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HFA3767IA? ▼

The minimum order quantity currently shown for HFA3767IA is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HFA3767IA original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HFA3767IA, please note this in your RFQ.

Can you provide a datasheet or technical support for HFA3767IA? ▼

Yes. You can view or download the HFA3767IA.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HFA3767IA, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HFA3767IA? ▼

Yes. Based on your application, preferred manufacturer, package 20-SSOP (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HFA3767IA. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HFA3767IA? ▼

As a RF Misc ICs and Modules product from Harris Corporation, HFA3767IA may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.