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HI5731BIPZ Renesas Electronics America Inc

Part No.:: HI5731BIPZ

Manufacturer:: Renesas Electronics America Inc

Category:: Data Acquisition - Digital to Analog Converters (DAC)

Package:: 28-DIP (0.600, 15.24mm)

Datasheet:: HI5731BIPZ.pdf

Description:: IC DAC 12BIT A-OUT 28DIP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is HI5731BIPZ Suitable For?

HI5731BIPZ is a Data Acquisition - Digital to Analog Converters (DAC) product from Renesas Electronics America Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Data Acquisition - Digital to Analog Converters (DAC) components. Engineers can review the HI5731BIPZ datasheet, package 28-DIP (0.600, 15.24mm) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Renesas Electronics America Inc components are required, helping engineers evaluate HI5731BIPZ specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HI5731BIPZ description, package 28-DIP (0.600, 15.24mm) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HI5731BIPZ datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HI5731BIPZ Pricing & Technical Support

Product Overview

HI5731BIPZ is a Data Acquisition - Digital to Analog Converters (DAC) product from Renesas Electronics America Inc. It is supplied in package 28-DIP (0.600, 15.24mm) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HI5731BIPZ datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC DAC 12BIT A-OUT 28DIP

Key Features

Part Number:HI5731BIPZ
Manufacturer:Renesas Electronics America Inc
Category:Data Acquisition - Digital to Analog Converters (DAC)
Package:28-DIP (0.600, 15.24mm)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HI5731BIPZ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HI5731BIPZ stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

28-DIP (0.600, 15.24mm)
Packaging:

Tube
Series:

-
ProductStatus:

Obsolete
NumberofBits:

12
NumberofD/AConverters:

1
SettlingTime:

20ns (Typ)
OutputType:

Current - Unbuffered
DifferentialOutput:

Yes
DataInterface:

Parallel
ReferenceType:

External, Internal
Voltage-SupplyAnalog:

5V
Voltage-SupplyDigital:

±5V
INL/DNL(LSB):

0.75, 0.5
Architecture:

R-2R, Segmented DAC
OperatingTemperature:

-40°C ~ 85°C
Category:

Data Acquisition - Digital to Analog Converters (DAC)
Datasheet:

HI5731BIPZ.pdf

HI5731BIPZ Frequently Asked Questions

Is HI5731BIPZ currently in stock? ▼

FudongIC currently shows 2,264 units of HI5731BIPZ in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HI5731BIPZ? ▼

The minimum order quantity currently shown for HI5731BIPZ is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HI5731BIPZ original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HI5731BIPZ, please note this in your RFQ.

Can you provide a datasheet or technical support for HI5731BIPZ? ▼

Yes. You can view or download the HI5731BIPZ.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HI5731BIPZ, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HI5731BIPZ? ▼

Yes. Based on your application, preferred manufacturer, package 28-DIP (0.600, 15.24mm), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HI5731BIPZ. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HI5731BIPZ? ▼

As a Data Acquisition - Digital to Analog Converters (DAC) product from Renesas Electronics America Inc, HI5731BIPZ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.