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HIN202EIBNZ-TR5661 Intersil

Part No.:: HIN202EIBNZ-TR5661

Manufacturer:: Intersil

Category:: Interface - Drivers, Receivers, Transceivers

Package:: 16-SOIC (0.154, 3.90mm Width)

Datasheet:: HIN202EIBNZ-TR5661.pdf

Description:: IC TRANSCEIVER FULL 2/2 16SO

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is HIN202EIBNZ-TR5661 Suitable For?

HIN202EIBNZ-TR5661 is a Interface - Drivers, Receivers, Transceivers product from Intersil, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Drivers, Receivers, Transceivers components. Engineers can review the HIN202EIBNZ-TR5661 datasheet, package 16-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Intersil components are required, helping engineers evaluate HIN202EIBNZ-TR5661 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HIN202EIBNZ-TR5661 description, package 16-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HIN202EIBNZ-TR5661 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HIN202EIBNZ-TR5661 Pricing & Technical Support

Product Overview

HIN202EIBNZ-TR5661 is a Interface - Drivers, Receivers, Transceivers product from Intersil. It is supplied in package 16-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HIN202EIBNZ-TR5661 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC TRANSCEIVER FULL 2/2 16SO

Key Features

Part Number:HIN202EIBNZ-TR5661
Manufacturer:Intersil
Category:Interface - Drivers, Receivers, Transceivers
Package:16-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HIN202EIBNZ-TR5661 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HIN202EIBNZ-TR5661 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

16-SOIC (0.154, 3.90mm Width)
Packaging:

Bulk
Series:

-
ProductStatus:

Obsolete
Type:

Transceiver
Protocol:

RS232
NumberofDrivers/Receivers:

2/2
Duplex:

Full
ReceiverHysteresis:

500 mV
DataRate:

230kbps
Voltage-Supply:

4.5V ~ 5.5V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - Drivers, Receivers, Transceivers
Datasheet:

HIN202EIBNZ-TR5661.pdf

HIN202EIBNZ-TR5661 Frequently Asked Questions

Is HIN202EIBNZ-TR5661 currently in stock? ▼

FudongIC currently shows 2,809 units of HIN202EIBNZ-TR5661 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HIN202EIBNZ-TR5661? ▼

The minimum order quantity currently shown for HIN202EIBNZ-TR5661 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HIN202EIBNZ-TR5661 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HIN202EIBNZ-TR5661, please note this in your RFQ.

Can you provide a datasheet or technical support for HIN202EIBNZ-TR5661? ▼

Yes. You can view or download the HIN202EIBNZ-TR5661.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HIN202EIBNZ-TR5661, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HIN202EIBNZ-TR5661? ▼

Yes. Based on your application, preferred manufacturer, package 16-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HIN202EIBNZ-TR5661. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HIN202EIBNZ-TR5661? ▼

As a Interface - Drivers, Receivers, Transceivers product from Intersil, HIN202EIBNZ-TR5661 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.