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HSE-B18635-0396H CUI Devices

Part No.:: HSE-B18635-0396H

Manufacturer:: CUI Devices

Category:: Thermal - Heat Sinks

Package:: TO-218

Datasheet:: HSE-B18635-0396H.pdf

Description:: HEAT SINK, EXTRUSION, TO-218, 63

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is HSE-B18635-0396H Suitable For?

HSE-B18635-0396H is a Thermal - Heat Sinks product from CUI Devices, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Thermal - Heat Sinks components. Engineers can review the HSE-B18635-0396H datasheet, package TO-218 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original CUI Devices components are required, helping engineers evaluate HSE-B18635-0396H specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HSE-B18635-0396H description, package TO-218 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HSE-B18635-0396H datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HSE-B18635-0396H Pricing & Technical Support

Product Overview

HSE-B18635-0396H is a Thermal - Heat Sinks product from CUI Devices. It is supplied in package TO-218 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HSE-B18635-0396H datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: HEAT SINK, EXTRUSION, TO-218, 63

Key Features

Part Number:HSE-B18635-0396H
Manufacturer:CUI Devices
Category:Thermal - Heat Sinks
Package:TO-218
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HSE-B18635-0396H may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HSE-B18635-0396H stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Box
Series:

HSE
ProductStatus:

Active
Type:

Board Level, Vertical
PackageCooled:

Bolt On and PC Pin
AttachmentMethod:

Rectangular, Angled Fins
Shape:

2.500 (63.50mm)
Length:

1.654 (42.00mm)
Width:

-
Diameter:

0.984 (25.00mm)
FinHeight:

13.7W @ 75°C
PowerDissipation@TemperatureRise:

2.78°C/W @ 200 LFM
ThermalResistance@ForcedAirFlow:

5.47°C/W
ThermalResistance@Natural:

Aluminum Alloy
Material:
Category:

Thermal - Heat Sinks
Datasheet:

HSE-B18635-0396H.pdf

HSE-B18635-0396H Frequently Asked Questions

Is HSE-B18635-0396H currently in stock? ▼

FudongIC currently shows 2,478 units of HSE-B18635-0396H in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HSE-B18635-0396H? ▼

The minimum order quantity currently shown for HSE-B18635-0396H is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HSE-B18635-0396H original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HSE-B18635-0396H, please note this in your RFQ.

Can you provide a datasheet or technical support for HSE-B18635-0396H? ▼

Yes. You can view or download the HSE-B18635-0396H.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HSE-B18635-0396H, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HSE-B18635-0396H? ▼

Yes. Based on your application, preferred manufacturer, package TO-218, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HSE-B18635-0396H. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HSE-B18635-0396H? ▼

As a Thermal - Heat Sinks product from CUI Devices, HSE-B18635-0396H may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.