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HYB18T1G800BF-3S Qimonda

Part No.:: HYB18T1G800BF-3S

Manufacturer:: Qimonda

Category:: Memory

Package:: 68-TFBGA

Datasheet:: HYB18T1G800BF-3S.pdf

Description:: IC SDRAM 1GBIT 333MHZ 68BGA

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Application Scenarios

What Applications Is HYB18T1G800BF-3S Suitable For?

HYB18T1G800BF-3S is a Memory product from Qimonda, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Memory components. Engineers can review the HYB18T1G800BF-3S datasheet, package 68-TFBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Qimonda components are required, helping engineers evaluate HYB18T1G800BF-3S specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HYB18T1G800BF-3S description, package 68-TFBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HYB18T1G800BF-3S datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HYB18T1G800BF-3S Pricing & Technical Support

Product Overview

HYB18T1G800BF-3S is a Memory product from Qimonda. It is supplied in package 68-TFBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HYB18T1G800BF-3S datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC SDRAM 1GBIT 333MHZ 68BGA

Key Features

Part Number:HYB18T1G800BF-3S
Manufacturer:Qimonda
Category:Memory
Package:68-TFBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HYB18T1G800BF-3S may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HYB18T1G800BF-3S stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Cut Tape (CT)
Series:

-
ProductStatus:

Discontinued at Mosen
MemoryType:

Volatile
MemoryFormat:

DRAM
Technology:

SDRAM - DDR2
MemorySize:

1Gb (128M x 8)
MemoryInterface:

Parallel
ClockFrequency:

333 MHz
WriteCycleTime-WordPage:

-
AccessTime:

-
Voltage-Supply:

1.7V ~ 1.9V
OperatingTemperature:

0°C ~ 95°C (TC)
MountingType:

Surface Mount
Category:

Memory
Datasheet:

HYB18T1G800BF-3S.pdf

HYB18T1G800BF-3S Frequently Asked Questions

Is HYB18T1G800BF-3S currently in stock? ▼

FudongIC currently shows 3,526 units of HYB18T1G800BF-3S in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HYB18T1G800BF-3S? ▼

The minimum order quantity currently shown for HYB18T1G800BF-3S is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HYB18T1G800BF-3S original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HYB18T1G800BF-3S, please note this in your RFQ.

Can you provide a datasheet or technical support for HYB18T1G800BF-3S? ▼

Yes. You can view or download the HYB18T1G800BF-3S.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HYB18T1G800BF-3S, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HYB18T1G800BF-3S? ▼

Yes. Based on your application, preferred manufacturer, package 68-TFBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HYB18T1G800BF-3S. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HYB18T1G800BF-3S? ▼

As a Memory product from Qimonda, HYB18T1G800BF-3S may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.