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HZA566M063G24VT-F Cornell Dubilier Electronics (CDE)

Part No.:: HZA566M063G24VT-F

Manufacturer:: Cornell Dubilier Electronics (CDE)

Category:: Aluminum - Polymer Capacitors

Package:

Datasheet:: HZA566M063G24VT-F.pdf

Description:: CAP ALUM POLY HYB 56UF 63V SMD

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Application Scenarios

What Applications Is HZA566M063G24VT-F Suitable For?

HZA566M063G24VT-F is a Aluminum - Polymer Capacitors product from Cornell Dubilier Electronics (CDE), suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Aluminum - Polymer Capacitors components. Engineers can review the HZA566M063G24VT-F datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Cornell Dubilier Electronics (CDE) components are required, helping engineers evaluate HZA566M063G24VT-F specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the HZA566M063G24VT-F description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports HZA566M063G24VT-F datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for HZA566M063G24VT-F Pricing & Technical Support

Product Overview

HZA566M063G24VT-F is a Aluminum - Polymer Capacitors product from Cornell Dubilier Electronics (CDE). It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide HZA566M063G24VT-F datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CAP ALUM POLY HYB 56UF 63V SMD

Key Features

Part Number:HZA566M063G24VT-F
Manufacturer:Cornell Dubilier Electronics (CDE)
Category:Aluminum - Polymer Capacitors
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

HZA566M063G24VT-F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for HZA566M063G24VT-F stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

HZA_V
ProductStatus:

Active
Type:

Hybrid
Capacitance:

56 µF
Tolerance:

±20%
Voltage-Rated:

63 V
ESR(EquivalentSeriesResistance):

30mOhm
Lifetime@Temp:

10000 Hrs @ 105°C
OperatingTemperature:

-55°C ~ 105°C
Ratings:

AEC-Q200
Applications:

Automotive, Bypass, Decoupling
Features:

-
RippleCurrent@LowFrequency:

180 mA @ 120 Hz
RippleCurrent@HighFrequency:

1.8 A @ 100 kHz
Impedance:

-
LeadSpacing:

-
Size/Dimension:

0.394 Dia (10.00mm)
Height-Seated(Max):

0.413 (10.50mm)
SurfaceMountLandSize:

0.406 L x 0.406 W (10.30mm x 10.30mm)
MountingType:

Surface Mount
Category:

Aluminum - Polymer Capacitors
Datasheet:

HZA566M063G24VT-F.pdf

HZA566M063G24VT-F Frequently Asked Questions

Is HZA566M063G24VT-F currently in stock? ▼

FudongIC currently shows 9,940 units of HZA566M063G24VT-F in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for HZA566M063G24VT-F? ▼

The minimum order quantity currently shown for HZA566M063G24VT-F is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is HZA566M063G24VT-F original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for HZA566M063G24VT-F, please note this in your RFQ.

Can you provide a datasheet or technical support for HZA566M063G24VT-F? ▼

Yes. You can view or download the HZA566M063G24VT-F.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for HZA566M063G24VT-F, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for HZA566M063G24VT-F? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for HZA566M063G24VT-F. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use HZA566M063G24VT-F? ▼

As a Aluminum - Polymer Capacitors product from Cornell Dubilier Electronics (CDE), HZA566M063G24VT-F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.