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IRG7S313UTRLPBF Infineon Technologies

Part No.:: IRG7S313UTRLPBF

Manufacturer:: Infineon Technologies

Category:: Transistors - IGBTs - Single

Package:: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB

Datasheet:: IRG7S313UTRLPBF.pdf

Description:: IGBT PDP 330V 40A D2PAK

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Application Scenarios

What Applications Is IRG7S313UTRLPBF Suitable For?

IRG7S313UTRLPBF is a Transistors - IGBTs - Single product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Transistors - IGBTs - Single components. Engineers can review the IRG7S313UTRLPBF datasheet, package TO-263-3, D²Pak (2 Leads + Tab), TO-263AB and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate IRG7S313UTRLPBF specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the IRG7S313UTRLPBF description, package TO-263-3, D²Pak (2 Leads + Tab), TO-263AB and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports IRG7S313UTRLPBF datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for IRG7S313UTRLPBF Pricing & Technical Support

Product Overview

IRG7S313UTRLPBF is a Transistors - IGBTs - Single product from Infineon Technologies. It is supplied in package TO-263-3, D²Pak (2 Leads + Tab), TO-263AB and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide IRG7S313UTRLPBF datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IGBT PDP 330V 40A D2PAK

Key Features

Part Number:IRG7S313UTRLPBF
Manufacturer:Infineon Technologies
Category:Transistors - IGBTs - Single
Package:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

IRG7S313UTRLPBF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for IRG7S313UTRLPBF stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Cut Tape (CT)
Series:

-
ProductStatus:

Obsolete
IGBTType:

Trench
Voltage-CollectorEmitterBreakdown(Max):

330 V
Current-Collector(Ic)(Max):

40 A
Current-CollectorPulsed(Icm):

-
Vce(on)(Max)@VgeIc:

2.14V @ 15V, 60A
Power-Max:

78 W
SwitchingEnergy:

-
InputType:

Standard
GateCharge:

33 nC
Td(on/off)@25°C:

1ns/65ns
TestCondition:

196V, 12A, 10Ohm
ReverseRecoveryTime(trr):

-
OperatingTemperature:

-
MountingType:

Surface Mount
Category:

Transistors - IGBTs - Single
Datasheet:

IRG7S313UTRLPBF.pdf

IRG7S313UTRLPBF Frequently Asked Questions

Is IRG7S313UTRLPBF currently in stock? ▼

FudongIC currently shows 3,017 units of IRG7S313UTRLPBF in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for IRG7S313UTRLPBF? ▼

The minimum order quantity currently shown for IRG7S313UTRLPBF is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is IRG7S313UTRLPBF original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for IRG7S313UTRLPBF, please note this in your RFQ.

Can you provide a datasheet or technical support for IRG7S313UTRLPBF? ▼

Yes. You can view or download the IRG7S313UTRLPBF.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for IRG7S313UTRLPBF, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for IRG7S313UTRLPBF? ▼

Yes. Based on your application, preferred manufacturer, package TO-263-3, D²Pak (2 Leads + Tab), TO-263AB, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for IRG7S313UTRLPBF. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use IRG7S313UTRLPBF? ▼

As a Transistors - IGBTs - Single product from Infineon Technologies, IRG7S313UTRLPBF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.