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IS45S16100C1-7TLA1-TR ISSI, Integrated Silicon Solution Inc

Part No.:: IS45S16100C1-7TLA1-TR

Manufacturer:: ISSI, Integrated Silicon Solution Inc

Category:: Memory

Package:: 50-TSOP (0.400, 10.16mm Width)

Datasheet:: IS45S16100C1-7TLA1-TR.pdf

Description:: IC DRAM 16MBIT PAR 50TSOP II

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Application Scenarios

What Applications Is IS45S16100C1-7TLA1-TR Suitable For?

IS45S16100C1-7TLA1-TR is a Memory product from ISSI, Integrated Silicon Solution Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Memory components. Engineers can review the IS45S16100C1-7TLA1-TR datasheet, package 50-TSOP (0.400, 10.16mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original ISSI, Integrated Silicon Solution Inc components are required, helping engineers evaluate IS45S16100C1-7TLA1-TR specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the IS45S16100C1-7TLA1-TR description, package 50-TSOP (0.400, 10.16mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports IS45S16100C1-7TLA1-TR datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for IS45S16100C1-7TLA1-TR Pricing & Technical Support

Product Overview

IS45S16100C1-7TLA1-TR is a Memory product from ISSI, Integrated Silicon Solution Inc. It is supplied in package 50-TSOP (0.400, 10.16mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide IS45S16100C1-7TLA1-TR datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC DRAM 16MBIT PAR 50TSOP II

Key Features

Part Number:IS45S16100C1-7TLA1-TR
Manufacturer:ISSI, Integrated Silicon Solution Inc
Category:Memory
Package:50-TSOP (0.400, 10.16mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

IS45S16100C1-7TLA1-TR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for IS45S16100C1-7TLA1-TR stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Obsolete
MemoryType:

Volatile
MemoryFormat:

DRAM
Technology:

SDRAM
MemorySize:

16Mb (1M x 16)
MemoryInterface:

Parallel
ClockFrequency:

143 MHz
WriteCycleTime-WordPage:

-
AccessTime:

5.5 ns
Voltage-Supply:

3V ~ 3.6V
OperatingTemperature:

-40°C ~ 85°C (TA)
MountingType:

Surface Mount
Category:

Memory
Datasheet:

IS45S16100C1-7TLA1-TR.pdf

IS45S16100C1-7TLA1-TR Frequently Asked Questions

Is IS45S16100C1-7TLA1-TR currently in stock? ▼

FudongIC currently shows 3,308 units of IS45S16100C1-7TLA1-TR in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for IS45S16100C1-7TLA1-TR? ▼

The minimum order quantity currently shown for IS45S16100C1-7TLA1-TR is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is IS45S16100C1-7TLA1-TR original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for IS45S16100C1-7TLA1-TR, please note this in your RFQ.

Can you provide a datasheet or technical support for IS45S16100C1-7TLA1-TR? ▼

Yes. You can view or download the IS45S16100C1-7TLA1-TR.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for IS45S16100C1-7TLA1-TR, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for IS45S16100C1-7TLA1-TR? ▼

Yes. Based on your application, preferred manufacturer, package 50-TSOP (0.400, 10.16mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for IS45S16100C1-7TLA1-TR. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use IS45S16100C1-7TLA1-TR? ▼

As a Memory product from ISSI, Integrated Silicon Solution Inc, IS45S16100C1-7TLA1-TR may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.