All Categories

View More Product Categories >>

ISL3179EIUZ Renesas Electronics America Inc

Part No.:: ISL3179EIUZ

Manufacturer:: Renesas Electronics America Inc

Category:: Interface - Drivers, Receivers, Transceivers

Package:: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Datasheet:: ISL3179EIUZ.pdf

Description:: IC TRANSCEIVER HALF 1/1 8MSOP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is ISL3179EIUZ Suitable For?

ISL3179EIUZ is a Interface - Drivers, Receivers, Transceivers product from Renesas Electronics America Inc, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Interface - Drivers, Receivers, Transceivers components. Engineers can review the ISL3179EIUZ datasheet, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Renesas Electronics America Inc components are required, helping engineers evaluate ISL3179EIUZ specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the ISL3179EIUZ description, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports ISL3179EIUZ datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for ISL3179EIUZ Pricing & Technical Support

Product Overview

ISL3179EIUZ is a Interface - Drivers, Receivers, Transceivers product from Renesas Electronics America Inc. It is supplied in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide ISL3179EIUZ datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC TRANSCEIVER HALF 1/1 8MSOP

Key Features

Part Number:ISL3179EIUZ
Manufacturer:Renesas Electronics America Inc
Category:Interface - Drivers, Receivers, Transceivers
Package:8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

ISL3179EIUZ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for ISL3179EIUZ stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Packaging:

Tube
Series:

-
ProductStatus:

Active
Type:

Transceiver
Protocol:

RS422, RS485
NumberofDrivers/Receivers:

1/1
Duplex:

Half
ReceiverHysteresis:

28 mV
DataRate:

40Mbps
Voltage-Supply:

3V ~ 3.6V
OperatingTemperature:

-40°C ~ 85°C
MountingType:

Surface Mount
Category:

Interface - Drivers, Receivers, Transceivers
Datasheet:

ISL3179EIUZ.pdf

ISL3179EIUZ Frequently Asked Questions

Is ISL3179EIUZ currently in stock? ▼

FudongIC currently shows 3,165 units of ISL3179EIUZ in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for ISL3179EIUZ? ▼

The minimum order quantity currently shown for ISL3179EIUZ is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is ISL3179EIUZ original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for ISL3179EIUZ, please note this in your RFQ.

Can you provide a datasheet or technical support for ISL3179EIUZ? ▼

Yes. You can view or download the ISL3179EIUZ.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for ISL3179EIUZ, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for ISL3179EIUZ? ▼

Yes. Based on your application, preferred manufacturer, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for ISL3179EIUZ. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use ISL3179EIUZ? ▼

As a Interface - Drivers, Receivers, Transceivers product from Renesas Electronics America Inc, ISL3179EIUZ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.