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LCS708HG Power Integrations

Part No.:: LCS708HG

Manufacturer:: Power Integrations

Category:: PMIC - Full, Half-Bridge Drivers

Package:: 16-SSIP, 13 Leads, Exposed Pad, Formed Leads

Datasheet:: LCS708HG.pdf

Description:: IC LLC CTRL MFET 440W ESIP16C

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is LCS708HG Suitable For?

LCS708HG is a PMIC - Full, Half-Bridge Drivers product from Power Integrations, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Full, Half-Bridge Drivers components. Engineers can review the LCS708HG datasheet, package 16-SSIP, 13 Leads, Exposed Pad, Formed Leads and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Power Integrations components are required, helping engineers evaluate LCS708HG specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LCS708HG description, package 16-SSIP, 13 Leads, Exposed Pad, Formed Leads and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LCS708HG datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for LCS708HG Pricing & Technical Support

Product Overview

LCS708HG is a PMIC - Full, Half-Bridge Drivers product from Power Integrations. It is supplied in package 16-SSIP, 13 Leads, Exposed Pad, Formed Leads and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LCS708HG datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC LLC CTRL MFET 440W ESIP16C

Key Features

Part Number:LCS708HG
Manufacturer:Power Integrations
Category:PMIC - Full, Half-Bridge Drivers
Package:16-SSIP, 13 Leads, Exposed Pad, Formed Leads
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

LCS708HG may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for LCS708HG stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tube
Series:

HiperLCS™
ProductStatus:

Active
OutputConfiguration:

Half Bridge
Applications:

General Purpose
Interface:

On/Off
LoadType:

Inductive
Technology:

Power MOSFET
RdsOn(Typ):

260mOhm
Current-Output/Channel:

-
Current-PeakOutput:

30.9A
Voltage-Supply:

11.4V ~ 15V
Voltage-Load:

11.4V ~ 15V
OperatingTemperature:

-40°C ~ 150°C (TJ)
Features:

Auto Restart, Slew Rate Controlled
FaultProtection:

Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
MountingType:

Through Hole
Category:

PMIC - Full, Half-Bridge Drivers
Datasheet:

LCS708HG.pdf

LCS708HG Frequently Asked Questions

Is LCS708HG currently in stock? ▼

FudongIC currently shows 3,359 units of LCS708HG in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for LCS708HG? ▼

The minimum order quantity currently shown for LCS708HG is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is LCS708HG original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LCS708HG, please note this in your RFQ.

Can you provide a datasheet or technical support for LCS708HG? ▼

Yes. You can view or download the LCS708HG.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LCS708HG, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for LCS708HG? ▼

Yes. Based on your application, preferred manufacturer, package 16-SSIP, 13 Leads, Exposed Pad, Formed Leads, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LCS708HG. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use LCS708HG? ▼

As a PMIC - Full, Half-Bridge Drivers product from Power Integrations, LCS708HG may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.