All Categories

View More Product Categories >>

LM56BIMM National Semiconductor

Part No.:: LM56BIMM

Manufacturer:: National Semiconductor

Category:: Temperature Sensors - Analog and Digital Output

Package:: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Datasheet:: LM56BIMM.pdf

Description:: DUAL TRIP POINT SWITCH/DIGITAL S

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is LM56BIMM Suitable For?

LM56BIMM is a Temperature Sensors - Analog and Digital Output product from National Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the LM56BIMM datasheet, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original National Semiconductor components are required, helping engineers evaluate LM56BIMM specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LM56BIMM description, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LM56BIMM datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for LM56BIMM Pricing & Technical Support

Product Overview

LM56BIMM is a Temperature Sensors - Analog and Digital Output product from National Semiconductor. It is supplied in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LM56BIMM datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: DUAL TRIP POINT SWITCH/DIGITAL S

Key Features

Part Number:LM56BIMM
Manufacturer:National Semiconductor
Category:Temperature Sensors - Analog and Digital Output
Package:8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

LM56BIMM may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for LM56BIMM stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Active
SensorType:

Analog, Local
SensingTemperature-Local:

-40°C ~ 125°C
SensingTemperature-Remote:

-
OutputType:

Analog Voltage
Voltage-Supply:

2.7V ~ 10V
Resolution:

6.2mV/°C
Features:

Output Switch
Accuracy-Highest(Lowest):

±2°C (±3°C)
TestCondition:

25°C ~ 85°C (-40°C ~ 125°C)
OperatingTemperature:

-40°C ~ 125°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

LM56BIMM.pdf

LM56BIMM Frequently Asked Questions

Is LM56BIMM currently in stock? ▼

FudongIC currently shows 3,844 units of LM56BIMM in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for LM56BIMM? ▼

The minimum order quantity currently shown for LM56BIMM is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is LM56BIMM original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LM56BIMM, please note this in your RFQ.

Can you provide a datasheet or technical support for LM56BIMM? ▼

Yes. You can view or download the LM56BIMM.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LM56BIMM, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for LM56BIMM? ▼

Yes. Based on your application, preferred manufacturer, package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LM56BIMM. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use LM56BIMM? ▼

As a Temperature Sensors - Analog and Digital Output product from National Semiconductor, LM56BIMM may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.