All Categories

View More Product Categories >>

LM75AD,118 NXP USA Inc.

Part No.:: LM75AD,118

Manufacturer:: NXP USA Inc.

Category:: Temperature Sensors - Analog and Digital Output

Package:: 8-SOIC (0.154, 3.90mm Width)

Datasheet:: LM75AD,118.pdf

Description:: SENSOR DIGITAL -55C-125C 8SO

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is LM75AD,118 Suitable For?

LM75AD,118 is a Temperature Sensors - Analog and Digital Output product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the LM75AD,118 datasheet, package 8-SOIC (0.154, 3.90mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate LM75AD,118 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LM75AD,118 description, package 8-SOIC (0.154, 3.90mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LM75AD,118 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for LM75AD,118 Pricing & Technical Support

Product Overview

LM75AD,118 is a Temperature Sensors - Analog and Digital Output product from NXP USA Inc.. It is supplied in package 8-SOIC (0.154, 3.90mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LM75AD,118 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR DIGITAL -55C-125C 8SO

Key Features

Part Number:LM75AD,118
Manufacturer:NXP USA Inc.
Category:Temperature Sensors - Analog and Digital Output
Package:8-SOIC (0.154, 3.90mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

LM75AD,118 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for LM75AD,118 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

-
ProductStatus:

Active
SensorType:

Digital, Local
SensingTemperature-Local:

-55°C ~ 125°C
SensingTemperature-Remote:

-
OutputType:

I²C
Voltage-Supply:

2.8V ~ 5.5V
Resolution:

11 b
Features:

Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Accuracy-Highest(Lowest):

±2°C (±3°C)
TestCondition:

-25°C ~ 100°C (-55°C ~ 125°C)
OperatingTemperature:

-55°C ~ 125°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

LM75AD,118.pdf

LM75AD,118 Frequently Asked Questions

Is LM75AD,118 currently in stock? ▼

FudongIC currently shows 2,989 units of LM75AD,118 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for LM75AD,118? ▼

The minimum order quantity currently shown for LM75AD,118 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is LM75AD,118 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LM75AD,118, please note this in your RFQ.

Can you provide a datasheet or technical support for LM75AD,118? ▼

Yes. You can view or download the LM75AD,118.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LM75AD,118, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for LM75AD,118? ▼

Yes. Based on your application, preferred manufacturer, package 8-SOIC (0.154, 3.90mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LM75AD,118. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use LM75AD,118? ▼

As a Temperature Sensors - Analog and Digital Output product from NXP USA Inc., LM75AD,118 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.