LM75BGD,125.pdf
Unit Price:Request Quote
Total:Submit an RFQ for pricing


LM75BGD,125 is a Temperature Sensors - Analog and Digital Output product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.
Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the LM75BGD,125 datasheet, package 8-XFDFN and stock availability to support component selection.
Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate LM75BGD,125 specifications, pricing and supply lead time.
Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LM75BGD,125 description, package 8-XFDFN and technical specifications for BOM matching.
Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LM75BGD,125 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.
FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.
Contact FudongIC for LM75BGD,125 Pricing & Technical SupportLM75BGD,125 is a Temperature Sensors - Analog and Digital Output product from NXP USA Inc.. It is supplied in package 8-XFDFN and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LM75BGD,125 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.
Product Description: SENSOR DGTL -55C-125C 8XSON
LM75BGD,125 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.
If you are looking for LM75BGD,125 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.
FudongIC currently shows 3,868 units of LM75BGD,125 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.
The minimum order quantity currently shown for LM75BGD,125 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.
FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LM75BGD,125, please note this in your RFQ.
Yes. You can view or download the LM75BGD,125.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LM75BGD,125, you can also contact the FudongIC technical and sales team.
Yes. Based on your application, preferred manufacturer, package 8-XFDFN, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LM75BGD,125. Please submit an RFQ with your original BOM or specification requirements.
As a Temperature Sensors - Analog and Digital Output product from NXP USA Inc., LM75BGD,125 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.
Send us an RFQ and our team will respond as soon as possible.
| Qty. | Unit Price | Total |
Sensirion AG
Sensirion AG
Sensirion AG
Panasonic Electronic Components
Panasonic Electronic Components
Analog Devices Inc./Maxim Integrated