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LPC2292FBD144/01,5 NXP USA Inc.

Part No.:: LPC2292FBD144/01,5

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microcontrollers

Package:: 144-LQFP

Datasheet:: LPC2292FBD144/01,5.pdf

Description:: IC MCU 16/32B 256KB FLSH 144LQFP

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Application Scenarios

What Applications Is LPC2292FBD144/01,5 Suitable For?

LPC2292FBD144/01,5 is a Embedded - Microcontrollers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the LPC2292FBD144/01,5 datasheet, package 144-LQFP and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate LPC2292FBD144/01,5 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LPC2292FBD144/01,5 description, package 144-LQFP and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LPC2292FBD144/01,5 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for LPC2292FBD144/01,5 Pricing & Technical Support

Product Overview

LPC2292FBD144/01,5 is a Embedded - Microcontrollers product from NXP USA Inc.. It is supplied in package 144-LQFP and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LPC2292FBD144/01,5 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 16/32B 256KB FLSH 144LQFP

Key Features

Part Number:LPC2292FBD144/01,5
Manufacturer:NXP USA Inc.
Category:Embedded - Microcontrollers
Package:144-LQFP
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

LPC2292FBD144/01,5 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for LPC2292FBD144/01,5 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

144-LQFP
Packaging:

Tray
Series:

LPC2200
ProductStatus:

RoHS
CoreProcessor:

60MHz
CoreSize:

16K x 8
Speed:

16/32-Bit
Connectivity:

-
Peripherals:

Not For New Designs
NumberofI/O:

POR, PWM, WDT
ProgramMemorySize:

CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
ProgramMemoryType:

Surface Mount
EEPROMSize:

112
RAMSize:

ARM7®
Voltage-Supply(Vcc/Vdd):

A/D 8x10b
DataConverters:

Internal
OscillatorType:

256KB (256K x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 85°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

LPC2292FBD144/01,5.pdf

LPC2292FBD144/01,5 Frequently Asked Questions

Is LPC2292FBD144/01,5 currently in stock? ▼

FudongIC currently shows 552 units of LPC2292FBD144/01,5 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for LPC2292FBD144/01,5? ▼

The minimum order quantity currently shown for LPC2292FBD144/01,5 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is LPC2292FBD144/01,5 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LPC2292FBD144/01,5, please note this in your RFQ.

Can you provide a datasheet or technical support for LPC2292FBD144/01,5? ▼

Yes. You can view or download the LPC2292FBD144/01,5.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LPC2292FBD144/01,5, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for LPC2292FBD144/01,5? ▼

Yes. Based on your application, preferred manufacturer, package 144-LQFP, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LPC2292FBD144/01,5. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use LPC2292FBD144/01,5? ▼

As a Embedded - Microcontrollers product from NXP USA Inc., LPC2292FBD144/01,5 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.