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LPC43S57JET256E NXP USA Inc.

Part No.:: LPC43S57JET256E

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microcontrollers

Package:: 256-LBGA

Datasheet:: LPC43S57JET256E.pdf

Description:: IC MCU 32BIT 1MB FLASH 256LBGA

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Application Scenarios

What Applications Is LPC43S57JET256E Suitable For?

LPC43S57JET256E is a Embedded - Microcontrollers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the LPC43S57JET256E datasheet, package 256-LBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate LPC43S57JET256E specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LPC43S57JET256E description, package 256-LBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LPC43S57JET256E datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for LPC43S57JET256E Pricing & Technical Support

Product Overview

LPC43S57JET256E is a Embedded - Microcontrollers product from NXP USA Inc.. It is supplied in package 256-LBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LPC43S57JET256E datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 32BIT 1MB FLASH 256LBGA

Key Features

Part Number:LPC43S57JET256E
Manufacturer:NXP USA Inc.
Category:Embedded - Microcontrollers
Package:256-LBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

LPC43S57JET256E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for LPC43S57JET256E stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

256-LBGA
Packaging:

Tray
Series:

LPC43xx
ProductStatus:

RoHS
CoreProcessor:

204MHz
CoreSize:

136K x 8
Speed:

32-Bit Dual-Core
Connectivity:

-
Peripherals:

Active
NumberofI/O:

Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, WDT
ProgramMemorySize:

CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
ProgramMemoryType:

Surface Mount
EEPROMSize:

164
RAMSize:

ARM® Cortex®-M4/M0
Voltage-Supply(Vcc/Vdd):

A/D 8x10b; D/A 1x10b
DataConverters:

Internal
OscillatorType:

1MB (1M x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 105°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

LPC43S57JET256E.pdf

LPC43S57JET256E Frequently Asked Questions

Is LPC43S57JET256E currently in stock? ▼

FudongIC currently shows 2,043 units of LPC43S57JET256E in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for LPC43S57JET256E? ▼

The minimum order quantity currently shown for LPC43S57JET256E is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is LPC43S57JET256E original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LPC43S57JET256E, please note this in your RFQ.

Can you provide a datasheet or technical support for LPC43S57JET256E? ▼

Yes. You can view or download the LPC43S57JET256E.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LPC43S57JET256E, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for LPC43S57JET256E? ▼

Yes. Based on your application, preferred manufacturer, package 256-LBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LPC43S57JET256E. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use LPC43S57JET256E? ▼

As a Embedded - Microcontrollers product from NXP USA Inc., LPC43S57JET256E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.