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LPC5526JBD100K NXP USA Inc.

Part No.:: LPC5526JBD100K

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microcontrollers

Package:: 100-LQFP Exposed Pad

Datasheet:: LPC5526JBD100K.pdf

Description:: IC MCU 32BIT 256KB FLSH 100HLQFP

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Application Scenarios

What Applications Is LPC5526JBD100K Suitable For?

LPC5526JBD100K is a Embedded - Microcontrollers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the LPC5526JBD100K datasheet, package 100-LQFP Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate LPC5526JBD100K specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the LPC5526JBD100K description, package 100-LQFP Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports LPC5526JBD100K datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for LPC5526JBD100K Pricing & Technical Support

Product Overview

LPC5526JBD100K is a Embedded - Microcontrollers product from NXP USA Inc.. It is supplied in package 100-LQFP Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide LPC5526JBD100K datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 32BIT 256KB FLSH 100HLQFP

Key Features

Part Number:LPC5526JBD100K
Manufacturer:NXP USA Inc.
Category:Embedded - Microcontrollers
Package:100-LQFP Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

LPC5526JBD100K may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for LPC5526JBD100K stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

100-LQFP Exposed Pad
Packaging:

Tray
Series:

LPC552x
ProductStatus:

RoHS
CoreProcessor:

150MHz
CoreSize:

144K x 8
Speed:

32-Bit
Connectivity:

-
Peripherals:

Active
NumberofI/O:

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ProgramMemorySize:

Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
ProgramMemoryType:

Surface Mount
EEPROMSize:

64
RAMSize:

ARM® Cortex®-M33
Voltage-Supply(Vcc/Vdd):

A/D 10x16b
DataConverters:

Internal
OscillatorType:

256KB (256K x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 105°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

LPC5526JBD100K.pdf

LPC5526JBD100K Frequently Asked Questions

Is LPC5526JBD100K currently in stock? ▼

FudongIC currently shows 3,274 units of LPC5526JBD100K in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for LPC5526JBD100K? ▼

The minimum order quantity currently shown for LPC5526JBD100K is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is LPC5526JBD100K original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for LPC5526JBD100K, please note this in your RFQ.

Can you provide a datasheet or technical support for LPC5526JBD100K? ▼

Yes. You can view or download the LPC5526JBD100K.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for LPC5526JBD100K, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for LPC5526JBD100K? ▼

Yes. Based on your application, preferred manufacturer, package 100-LQFP Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for LPC5526JBD100K. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use LPC5526JBD100K? ▼

As a Embedded - Microcontrollers product from NXP USA Inc., LPC5526JBD100K may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.