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MAX1618MUB+T Analog Devices Inc./Maxim Integrated

Part No.:: MAX1618MUB+T

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Temperature Sensors - Analog and Digital Output

Package:: 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)

Datasheet:: MAX1618MUB+T.pdf

Description:: SENSOR DIGITAL REMOTE 10UMAX

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Application Scenarios

What Applications Is MAX1618MUB+T Suitable For?

MAX1618MUB+T is a Temperature Sensors - Analog and Digital Output product from Analog Devices Inc./Maxim Integrated, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the MAX1618MUB+T datasheet, package 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Analog Devices Inc./Maxim Integrated components are required, helping engineers evaluate MAX1618MUB+T specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the MAX1618MUB+T description, package 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports MAX1618MUB+T datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for MAX1618MUB+T Pricing & Technical Support

Product Overview

MAX1618MUB+T is a Temperature Sensors - Analog and Digital Output product from Analog Devices Inc./Maxim Integrated. It is supplied in package 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide MAX1618MUB+T datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR DIGITAL REMOTE 10UMAX

Key Features

Part Number:MAX1618MUB+T
Manufacturer:Analog Devices Inc./Maxim Integrated
Category:Temperature Sensors - Analog and Digital Output
Package:10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

MAX1618MUB+T may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for MAX1618MUB+T stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Active
SensorType:

Digital, Remote
SensingTemperature-Local:

-
SensingTemperature-Remote:

-55°C ~ 125°C
OutputType:

SMBus
Voltage-Supply:

3V ~ 5.5V
Resolution:

7 b
Features:

One-Shot, Output Switch, Standby Mode
Accuracy-Highest(Lowest):

±3°C (±5°C)
TestCondition:

60°C ~ 100°C (-55°C ~ 120°C)
OperatingTemperature:

-55°C ~ 125°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

MAX1618MUB+T.pdf

MAX1618MUB+T Frequently Asked Questions

Is MAX1618MUB+T currently in stock? ▼

FudongIC currently shows 3,986 units of MAX1618MUB+T in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for MAX1618MUB+T? ▼

The minimum order quantity currently shown for MAX1618MUB+T is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is MAX1618MUB+T original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for MAX1618MUB+T, please note this in your RFQ.

Can you provide a datasheet or technical support for MAX1618MUB+T? ▼

Yes. You can view or download the MAX1618MUB+T.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for MAX1618MUB+T, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for MAX1618MUB+T? ▼

Yes. Based on your application, preferred manufacturer, package 10-TFSOP, 10-MSOP (0.118, 3.00mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for MAX1618MUB+T. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use MAX1618MUB+T? ▼

As a Temperature Sensors - Analog and Digital Output product from Analog Devices Inc./Maxim Integrated, MAX1618MUB+T may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.