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MAX31875R0TZS+ Analog Devices Inc./Maxim Integrated

Part No.:: MAX31875R0TZS+

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Temperature Sensors - Analog and Digital Output

Package:: 4-XFBGA, WLBGA

Datasheet:: MAX31875R0TZS+.pdf

Description:: SENSOR DIGITAL -10C-100C 4WLP

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Application Scenarios

What Applications Is MAX31875R0TZS+ Suitable For?

MAX31875R0TZS+ is a Temperature Sensors - Analog and Digital Output product from Analog Devices Inc./Maxim Integrated, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Temperature Sensors - Analog and Digital Output components. Engineers can review the MAX31875R0TZS+ datasheet, package 4-XFBGA, WLBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Analog Devices Inc./Maxim Integrated components are required, helping engineers evaluate MAX31875R0TZS+ specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the MAX31875R0TZS+ description, package 4-XFBGA, WLBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports MAX31875R0TZS+ datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for MAX31875R0TZS+ Pricing & Technical Support

Product Overview

MAX31875R0TZS+ is a Temperature Sensors - Analog and Digital Output product from Analog Devices Inc./Maxim Integrated. It is supplied in package 4-XFBGA, WLBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide MAX31875R0TZS+ datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: SENSOR DIGITAL -10C-100C 4WLP

Key Features

Part Number:MAX31875R0TZS+
Manufacturer:Analog Devices Inc./Maxim Integrated
Category:Temperature Sensors - Analog and Digital Output
Package:4-XFBGA, WLBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

MAX31875R0TZS+ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for MAX31875R0TZS+ stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Active
SensorType:

Digital, Local
SensingTemperature-Local:

-10°C ~ 100°C
SensingTemperature-Remote:

-
OutputType:

I²C
Voltage-Supply:

1.6V ~ 3.6V
Resolution:

12 b
Features:

One-Shot, Shutdown Mode, Standby Mode
Accuracy-Highest(Lowest):

±2°C (±3°C)
TestCondition:

-10°C ~ 100°C (-20°C ~ 125°C)
OperatingTemperature:

-20°C ~ 150°C
MountingType:

Surface Mount
Category:

Temperature Sensors - Analog and Digital Output
Datasheet:

MAX31875R0TZS+.pdf

MAX31875R0TZS+ Frequently Asked Questions

Is MAX31875R0TZS+ currently in stock? ▼

FudongIC currently shows 2,939 units of MAX31875R0TZS+ in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for MAX31875R0TZS+? ▼

The minimum order quantity currently shown for MAX31875R0TZS+ is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is MAX31875R0TZS+ original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for MAX31875R0TZS+, please note this in your RFQ.

Can you provide a datasheet or technical support for MAX31875R0TZS+? ▼

Yes. You can view or download the MAX31875R0TZS+.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for MAX31875R0TZS+, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for MAX31875R0TZS+? ▼

Yes. Based on your application, preferred manufacturer, package 4-XFBGA, WLBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for MAX31875R0TZS+. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use MAX31875R0TZS+? ▼

As a Temperature Sensors - Analog and Digital Output product from Analog Devices Inc./Maxim Integrated, MAX31875R0TZS+ may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.