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MC33879TEKR2 NXP USA Inc.

Part No.:: MC33879TEKR2

Manufacturer:: NXP USA Inc.

Category:: PMIC - Full, Half-Bridge Drivers

Package:: 32-BSSOP (0.295, 7.50mm Width) Exposed Pad

Datasheet:: MC33879TEKR2.pdf

Description:: IC SW SERIAL OCTAL 32SOIC

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is MC33879TEKR2 Suitable For?

MC33879TEKR2 is a PMIC - Full, Half-Bridge Drivers product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Full, Half-Bridge Drivers components. Engineers can review the MC33879TEKR2 datasheet, package 32-BSSOP (0.295, 7.50mm Width) Exposed Pad and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate MC33879TEKR2 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the MC33879TEKR2 description, package 32-BSSOP (0.295, 7.50mm Width) Exposed Pad and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports MC33879TEKR2 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for MC33879TEKR2 Pricing & Technical Support

Product Overview

MC33879TEKR2 is a PMIC - Full, Half-Bridge Drivers product from NXP USA Inc.. It is supplied in package 32-BSSOP (0.295, 7.50mm Width) Exposed Pad and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide MC33879TEKR2 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC SW SERIAL OCTAL 32SOIC

Key Features

Part Number:MC33879TEKR2
Manufacturer:NXP USA Inc.
Category:PMIC - Full, Half-Bridge Drivers
Package:32-BSSOP (0.295, 7.50mm Width) Exposed Pad
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

MC33879TEKR2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for MC33879TEKR2 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR)
Series:

-
ProductStatus:

Last Time Buy
OutputConfiguration:

-
Applications:

-
Interface:

-
LoadType:

-
Technology:

-
RdsOn(Typ):

750mOhm
Current-Output/Channel:

-
Current-PeakOutput:

1.2A
Voltage-Supply:

5.5V ~ 26.5V
Voltage-Load:

-
OperatingTemperature:

-40°C ~ 125°C
Features:

-
FaultProtection:

-
MountingType:

Surface Mount
Category:

PMIC - Full, Half-Bridge Drivers
Datasheet:

MC33879TEKR2.pdf

MC33879TEKR2 Frequently Asked Questions

Is MC33879TEKR2 currently in stock? ▼

FudongIC currently shows 3,800 units of MC33879TEKR2 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for MC33879TEKR2? ▼

The minimum order quantity currently shown for MC33879TEKR2 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is MC33879TEKR2 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for MC33879TEKR2, please note this in your RFQ.

Can you provide a datasheet or technical support for MC33879TEKR2? ▼

Yes. You can view or download the MC33879TEKR2.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for MC33879TEKR2, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for MC33879TEKR2? ▼

Yes. Based on your application, preferred manufacturer, package 32-BSSOP (0.295, 7.50mm Width) Exposed Pad, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for MC33879TEKR2. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use MC33879TEKR2? ▼

As a PMIC - Full, Half-Bridge Drivers product from NXP USA Inc., MC33879TEKR2 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.