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MC8641DHX1500KE557 Freescale Semiconductor - NXP

Part No.:: MC8641DHX1500KE557

Manufacturer:: Freescale Semiconductor - NXP

Category:: Embedded - Microprocessors

Package:: 1023-BBGA, FCBGA

Datasheet:: MC8641DHX1500KE557.pdf

Description:: RISC MICROPROCESSOR, 32-BIT, POW

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is MC8641DHX1500KE557 Suitable For?

MC8641DHX1500KE557 is a Embedded - Microprocessors product from Freescale Semiconductor - NXP, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microprocessors components. Engineers can review the MC8641DHX1500KE557 datasheet, package 1023-BBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Freescale Semiconductor - NXP components are required, helping engineers evaluate MC8641DHX1500KE557 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the MC8641DHX1500KE557 description, package 1023-BBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports MC8641DHX1500KE557 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for MC8641DHX1500KE557 Pricing & Technical Support

Product Overview

MC8641DHX1500KE557 is a Embedded - Microprocessors product from Freescale Semiconductor - NXP. It is supplied in package 1023-BBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide MC8641DHX1500KE557 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: RISC MICROPROCESSOR, 32-BIT, POW

Key Features

Part Number:MC8641DHX1500KE557
Manufacturer:Freescale Semiconductor - NXP
Category:Embedded - Microprocessors
Package:1023-BBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

MC8641DHX1500KE557 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for MC8641DHX1500KE557 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

1023-BBGA, FCBGA
Packaging:

Bulk
Series:

-
ProductStatus:

Obsolete
CoreProcessor:

PowerPC e600
NumberofCores/BusWidth:

2 Core, 32-Bit
Speed:

1.5GHz
Co-Processors/DSP:

-
RAMControllers:

DDR, DDR2
GraphicsAcceleration:

No
Display&InterfaceControllers:

-
Ethernet:

10/100/1000Mbps (4)
SATA:

-
USB:

-
Voltage-I/O:

1.8V, 2.5V, 3.3V
OperatingTemperature:

0°C ~ 105°C (TA)
SecurityFeatures:

-
Category:

Embedded - Microprocessors
Datasheet:

MC8641DHX1500KE557.pdf

MC8641DHX1500KE557 Frequently Asked Questions

Is MC8641DHX1500KE557 currently in stock? ▼

FudongIC currently shows 211 units of MC8641DHX1500KE557 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for MC8641DHX1500KE557? ▼

The minimum order quantity currently shown for MC8641DHX1500KE557 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is MC8641DHX1500KE557 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for MC8641DHX1500KE557, please note this in your RFQ.

Can you provide a datasheet or technical support for MC8641DHX1500KE557? ▼

Yes. You can view or download the MC8641DHX1500KE557.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for MC8641DHX1500KE557, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for MC8641DHX1500KE557? ▼

Yes. Based on your application, preferred manufacturer, package 1023-BBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for MC8641DHX1500KE557. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use MC8641DHX1500KE557? ▼

As a Embedded - Microprocessors product from Freescale Semiconductor - NXP, MC8641DHX1500KE557 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.