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MPC755CVT350LE NXP USA Inc.

Part No.:: MPC755CVT350LE

Manufacturer:: NXP USA Inc.

Category:: Embedded - Microprocessors

Package:: 360-BBGA, FCBGA

Datasheet:: MPC755CVT350LE.pdf

Description:: POWERPC MICROPROCESSOR IC MPC7XX

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Application Scenarios

What Applications Is MPC755CVT350LE Suitable For?

MPC755CVT350LE is a Embedded - Microprocessors product from NXP USA Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microprocessors components. Engineers can review the MPC755CVT350LE datasheet, package 360-BBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original NXP USA Inc. components are required, helping engineers evaluate MPC755CVT350LE specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the MPC755CVT350LE description, package 360-BBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports MPC755CVT350LE datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for MPC755CVT350LE Pricing & Technical Support

Product Overview

MPC755CVT350LE is a Embedded - Microprocessors product from NXP USA Inc.. It is supplied in package 360-BBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide MPC755CVT350LE datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: POWERPC MICROPROCESSOR IC MPC7XX

Key Features

Part Number:MPC755CVT350LE
Manufacturer:NXP USA Inc.
Category:Embedded - Microprocessors
Package:360-BBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

MPC755CVT350LE may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for MPC755CVT350LE stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

360-BBGA, FCBGA
Packaging:

Tray
Series:

MPC7xx
ProductStatus:

Obsolete
CoreProcessor:

PowerPC
NumberofCores/BusWidth:

1 Core, 32-Bit
Speed:

350MHz
Co-Processors/DSP:

-
RAMControllers:

-
GraphicsAcceleration:

No
Display&InterfaceControllers:

-
Ethernet:

-
SATA:

-
USB:

-
Voltage-I/O:

2.5V, 3.3V
OperatingTemperature:

0°C ~ 105°C (TA)
SecurityFeatures:

-
Category:

Embedded - Microprocessors
Datasheet:

MPC755CVT350LE.pdf

MPC755CVT350LE Frequently Asked Questions

Is MPC755CVT350LE currently in stock? ▼

FudongIC currently shows 3,164 units of MPC755CVT350LE in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for MPC755CVT350LE? ▼

The minimum order quantity currently shown for MPC755CVT350LE is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is MPC755CVT350LE original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for MPC755CVT350LE, please note this in your RFQ.

Can you provide a datasheet or technical support for MPC755CVT350LE? ▼

Yes. You can view or download the MPC755CVT350LE.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for MPC755CVT350LE, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for MPC755CVT350LE? ▼

Yes. Based on your application, preferred manufacturer, package 360-BBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for MPC755CVT350LE. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use MPC755CVT350LE? ▼

As a Embedded - Microprocessors product from NXP USA Inc., MPC755CVT350LE may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.