MSP430G2755IDA38R Texas Instruments

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Part No.:: MSP430G2755IDA38R

Manufacturer:: Texas Instruments

Category:: Embedded - Microcontrollers

Package:: 38-TSSOP (0.240", 6.10mm Width)

Datasheet:: MSP430G2755IDA38R.pdf

Description:: IC MCU 16BIT 32KB FLASH 38TSSOP

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Application Scenarios

What Applications Is MSP430G2755IDA38R Suitable For?

MSP430G2755IDA38R is a Embedded - Microcontrollers product from Texas Instruments, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - Microcontrollers components. Engineers can review the MSP430G2755IDA38R datasheet, package 38-TSSOP (0.240", 6.10mm Width) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Texas Instruments components are required, helping engineers evaluate MSP430G2755IDA38R specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the MSP430G2755IDA38R description, package 38-TSSOP (0.240", 6.10mm Width) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports MSP430G2755IDA38R datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for MSP430G2755IDA38R Pricing & Technical Support

Product Overview

MSP430G2755IDA38R is a Embedded - Microcontrollers product from Texas Instruments. It is supplied in package 38-TSSOP (0.240", 6.10mm Width) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide MSP430G2755IDA38R datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC MCU 16BIT 32KB FLASH 38TSSOP

Key Features

Part Number:MSP430G2755IDA38R
Manufacturer:Texas Instruments
Category:Embedded - Microcontrollers
Package:38-TSSOP (0.240", 6.10mm Width)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

MSP430G2755IDA38R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for MSP430G2755IDA38R stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

38-TSSOP (0.240", 6.10mm Width)
Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

MSP430G2xx
ProductStatus:

RoHS
CoreProcessor:

16MHz
CoreSize:

4K x 8
Speed:

16-Bit
Connectivity:

-
Peripherals:

Active
NumberofI/O:

Brown-out Detect/Reset, POR, WDT
ProgramMemorySize:

I²C, IrDA, LINbus, SCI, SPI, UART/USART
ProgramMemoryType:

Surface Mount
EEPROMSize:

32
RAMSize:

MSP430
Voltage-Supply(Vcc/Vdd):

A/D 12x10b
DataConverters:

Internal
OscillatorType:

32KB (32K x 8)
OperatingTemperature:

FLASH
MountingType:

-40°C ~ 85°C (TA)
Category:

Embedded - Microcontrollers
Datasheet:

MSP430G2755IDA38R.pdf

MSP430G2755IDA38R Frequently Asked Questions

Is MSP430G2755IDA38R currently in stock? ▼

FudongIC currently shows 2,536 units of MSP430G2755IDA38R in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for MSP430G2755IDA38R? ▼

The minimum order quantity currently shown for MSP430G2755IDA38R is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is MSP430G2755IDA38R original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for MSP430G2755IDA38R, please note this in your RFQ.

Can you provide a datasheet or technical support for MSP430G2755IDA38R? ▼

Yes. You can view or download the MSP430G2755IDA38R.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for MSP430G2755IDA38R, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for MSP430G2755IDA38R? ▼

Yes. Based on your application, preferred manufacturer, package 38-TSSOP (0.240", 6.10mm Width), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for MSP430G2755IDA38R. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use MSP430G2755IDA38R? ▼

As a Embedded - Microcontrollers product from Texas Instruments, MSP430G2755IDA38R may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.